ASE Officiates Groundbreaking Ceremony for its Shanghai
Shanghai, China, September 21, 2011 – Advanced Semiconductor Engineering Incorporated (ASE, TAIEX: 2311, NYSE: ASX), the world’s largest semiconductor packaging and test company, today officiated the groundbreaking ceremony of its Shanghai Headquarters in the Zhangjiang Industrial Park. The event was attended by Mr. Lien Chan, the Honorary Chairman of the Kuomintang Party.
The ASE Shanghai Headquarters, to be gradually opened in three phases, occupies an land area of 120, 000 square meters. In line with ASE’s emphasis on corporate social responsibility, the design and construction of its corporate building includes several green concepts focused on energy, material and water efficiency, environmental protection, waste reduction as well as the promotion of a healthy work environment.
Since ASE’s foray into China, its investment in the Zhangjiang region has grown to over US$2 billion and it now employs over 11, 000 people at its manufacturing facility. The company plans to invest another US$3.7 billion in the Jingqiao industrial area to further expand its semiconductor assembly and manufacturing service offerings. Within the next eight to ten years, ASE expects its investment to exceed US$6 billion, generating annual revenues of US$8.5 billion and employing over 50, 000 people in Shanghai.
To aid in the expansion of ASE’s manufacturing capabilities and volume output, ASE believes that it needs to hire the right number of people equipped with the right skills. There exists a huge pool of highly educated engineers in China, however, challenges surround training and retaining these skilled workers. ASE plans to establish the Shanghai headquarters to recruit, train, and retain these talents so as to provide a consistent and reputable support system with quality manufacturing output to its customers.
About ASE, Inc.
ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com or follow us on Twitter: @aseglobal.