ASE Packages One Billion Bluetooth Devices for CSR
Santa Clara, California, June 17, 2008 – Advanced Semiconductor Engineering Incorporated (ASE, TAIEX: 2311, NYSE: ASX), the world’s largest semiconductor packaging and test company, announced today that it has provided CSR with the subcontractor assembly services that facilitated the shipment of its first one billion Bluetooth devices. CSR, the leading global provider of personal wireless technology, selected ASE for consistently providing the technology and manufacturing acumen critical to the successful manufacture of Bluetooth devices.
ASE provides CSR with full turnkey services, encompassing bumping, WLCSP, BGA/Leadframe packaging, wafer probe, and final test solutions, at facilities strategically located across Asia. Through a close working relationship, ASE offers qualified packaging technologies and roadmaps that align with CSR device specifications and needs. ASE’s dedicated local support teams help accelerate package development, improve time-to-market, and enhance satisfaction in line with CSR’s current and evolving needs.
“CSR leads the market in Bluetooth technology and our partnership with ASE plays a significant role in our continuing success. CSR has been able to leverage ASE’s industry-leading fabrication technology and manufacturing capacity to its advantage”, said Patrick McNamee, VP of Process Engineering, CSR. “ASE has played an integral role in the production of our first billion devices and we look forward to an increasingly stronger partnership as we continue to meet demand in high growth areas.”
“We are very proud to have packaged every single Bluetooth device which CSR has brought to market, through the successful alignment of our manufacturing strategy with CSR’s product and market objectives, ” said Dr Tien Wu, COO, ASE Group. “Both ASE and CSR have extensive history as innovators, and together we have achieved a significant milestone, which is testament to our combined market leadership and expertise.”
About ASE, Inc.
ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com or follow us on Twitter: @aseglobal.