Press Room

2016 / 06 / 24

ASE Receives 2016 Asia Responsible Entrepreneurship Award

ASE30 Environmental Conservation Fund demonstrates commitment to Taiwan’s environmental conservation and protection efforts

Taipei, Taiwan, June 24, 2016 – Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX) today announced it has received the 2016 Asia Responsible Entrepreneurship Award (AREA) in the catego ry of “Social Empowerment” for its ASE30 Environmental Conservation Fund (ECF). The AREA program recognizes and honors Asian companies for championing sustainable and responsible entrepreneurship and implementing programs that demonstrate their leadership, sincerity and ongo ing commitment in incorporating responsible and ethical values, legal compliance, respect for people and individuals, involvement in communities and protection of the environment into the way they run their businesses.

“Despite the globalization of the ASE Group, the company has not forgo tten its beginnings in Kaohsiung, Taiwan, where its first semiconductor assembly production facility was established in 1984, ” commented Jason Chang, Chairman and CEO, ASE Group. “Taiwan is an island with finite resources, and through the ASE30 Environmental Conservation Fund, we hope to ensure the continued protection of the land and care for the local community.”

The ASE30 Environmental Conservation Fund, for which ASE is being honored, was established in 2014 to commemorate the company’s 30th anniversary and to promote programs in support of environmental protection efforts in Taiwan. The company has committed to contributing NT$100 million (US$3 million) per year from the NT$3 billion (US$100 million) fund for the next 30 years.

The ECF focuses on four key aspects — environmental education promotion, environmental quality enhancement, environmental impact minimization and environmental arts promotion. To date, ASE has undertaken the following projects under the ASE30 ECF:

Environmental Education Promotion Program:
• Green Classrooms Project
• Environmental Thesis/Dissertation Awards
• Environmental Education Video Projects
• Environmental Technology Research Projects
• International Environmental Law Seminar
• Environmental Education in Elementary Schools
Environmental Quality Enhancement Program:
• Afforestation Projects
• Green Fence Project at the Nantze Export Processing Zone
Environmental Impact Minimization Program:
• Campus LED Donation Projects
• Water Recycling Model Plant Operation Sponsorship
• Green Supply Chain Projects
• Environmental Hygiene – Dengue Fever Prevention
Environmental Arts Promotion Program:
• Environmental Arts Promotion – KUSAMA YAYOI
• 3-D Musical about the Environment – Voyage undersea

Seeking to lead by example, ASE personnel themselves have been actively involved in organizing and participating in the programs funded by the ASE30 ECF. Since the fund’s establishment two years ago , approximately 60 schools and 230, 000 students have benefited from the program, and over 84 hectares of land have been reforested with the planting of 90, 000 native trees.

Go ing forward, ASE will continue to reinforce its corporate social responsibility through the integration of its technology know-how and financial and human resources for the greater go od of the local community. ASE will continue to advocate for the nurturing, support and hiring of local talent in an effort to raise the quality of living standards. ASE will also further pursue green initiatives and sustainability objectives as a responsible corporate citizen.

About Enterprise Asia
The AREA award program is organized by Enterprise Asia, a non-go vernmental organization in pursuit of creating an Asia that is rich in entrepreneurship as an engine towards sustainable and progressive economic and social development within a world of economic equality. For more information, visit


About ASE, Inc.

ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: or follow us on Twitter: @aseglobal.

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