Press Room

2002 / 11 / 25

ASE Receives Sub-contracting Supplier of the Year Award from Tower Semiconductor

Santa Clara, California, November 25, 2002 – Advanced Semiconductor Engineering, Inc. (NYSE: ASX), one of the world’s largest semiconductor packaging and testing companies, today announced that it has received the Sub-contracting Supplier of the Year Award from Tower Semiconductor (NASDAQ: TSEM, TASE: TSEM). ASE provides assembly and testing services for Tower Semiconductor’s advanced flash memory and CMOS image sensor IC chips.

In 1997, Tower Semiconductor established the Supplier Management Program, “Sharing a Common Go al” to provide a dialogue between Tower and its key suppliers. The Sub-contracting Supplier Award is derived from this program and recognizes supplier performance based on a stringent scoring system in the catego ries for service, delivery, technology and systems, and cost.

“Ultimately, the Supplier Management Program focuses on maintaining long term partnerships with suppliers, benefiting Tower’s customers through consistent equipment and service quality, ” said Ron Niv, Fab 2 Manager in Tower Semiconductor, Inc. “We look forward to maintaining the high standards set between Tower and ASE for test and assembly.”

“ASE is highly focused on customer satisfaction and recognizes that the key to achieving it go es beyond providing essential technologies and quality products. We also understand that each customer is unique in their requirements and we will go the extra mile to fulfill these individual needs, ” said Dr. Tien Wu, President of ASE Americas and Europe. “ASE is honored to receive the Tower Supplier Award, and we will work diligently for continuous improvement in order to contribute to the success of Tower and ASE.”


About ASE, Inc.

ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: or follow us on Twitter: @aseglobal.

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