Press Room

2005 / 09 / 27


Santa Clara, California, September 27, 2005 – Advanced Semiconductor Engineering Incorporated (ASE, TAIEX: 2311, NYSE: ASX), the world’s largest semiconductor packaging and test company, announced today it will be a platinum sponsor for the 2005 FSA Suppliers Expo and Conference. The event will be held from October 5-6 at the San Jose McEnery Convention Center in San Jose.

The event brings together semiconductor industry professionals from around the globe to cultivate and further business partnerships. It features a forum for over 100 exhibitors to showcase their products and services and provides two days of business education focusing on key topics in the semiconductor sector.

“ASE recognizes that the FSA continues to play a significant part in fostering growth in the relationship between the fabless and foundry communities, ” commented Dr. Tien Wu, President, Americas/Europe and Worldwide Marketing & Sales, ASE Group. “By bringing industry players together, everyone benefits by better understanding the future direction of the fabless model. ASE is proud to sponsor the FSA Suppliers Expo.”

“We thank ASE Group for its global support, sponsoring not only FSA’s Suppliers Expo, but also FSA’s Expo TAIWAN, for the second year in a row, ” said Jodi Shelton, co-founder and executive director of FSA. “ASE Group has been an FSA member for five years. We appreciate the company’s involvement in the association including its leadership role on our Board of Directors.”

For additional information about the event or to register, visit To schedule a meeting with ASE, contact Jennifer Yuen at or 408.986.6519.


About ASE, Inc.

ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: or follow us on Twitter: @aseglobal.

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