ASE to Showcase System-in-Package Applications at Computex 2015
Show suite to demonstrate IoT and Connectivity using ASE SiP technology
Taipei, May 29, 2015 – Advanced Semiconductor Engineering, Inc (TAIEX: 2311, NYSE: ASX), the world’s largest semiconductor assembly and test service provider, today announced it will be showcasing System in Package (SiP) solutions in consumer applications at Computex 2015, scheduled to take place in Taipei, Taiwan, over June 2-6, 2015. These SiP applications highlight the synergy between ASE’s IC packaging, material and test technologies, together with the strong expertise of Universal Scientific Industrial Shanghai Co, Ltd (USI; SHA: 601231) in module level manufacturing services to bring SiP into the realm of the Internet-of-Things (IoT).
SiP technology enables multiple semiconductor chips and passive components to be integrated within a smaller and more compact module without compromising the functionality and performance of the entire package or module. Hence, SiP can be ideally applied to many of today’s consumer technologies that require heterogeneous integration of numerous IC functions such as RF, processor, memory, sensors, power management, multimedia, and more, within very tight space constraints.
ASE’s developments in SiP also serve to protect the environment as it reduces the number of required manufacturing steps. Previously, each device function was developed onto individual IC chips, but with SiP technology, the ICs can be designed and directly embedded onto a substrate, then onto a module. The reduction in manufacturing steps results in less required materials as well as increased efficiency in logistics management during inventory shipment.
To better serve the fast-growing IoT segment, ASE has evolved its business model by combining its technologies in wire bonding, wafer level, fan-out, flip chip, 2.5D/3D, substrates and embedded IC packaging with USI’s module level assembly to establish a strong leadership in SiP. ASE has also created a cohesive ecosystem for its SiP platform that included a key announcement with Inotera Memories Inc (April 7, 2014) on foundry service for 2.5D silicon interposer and TDK Corporation (May 8, 2015) for proprietary embedded substrate manufacturing. The collaboration within the supply chain has led to the development of a world class manufacturing technology that can be used in embedded solutions within smartphones, wearables, homes, connectivity and sensor applications.
Computex attendees will find the end result of this collaboration on display in the ASE VIP suite which is located on the second floor of the Taipei International Convention Center, number T203A. The exhibits on display will include mesh lighting (smart lighting) that can be controlled through an iPad, environmental sensors, Beacon (micro location) technology, wearables, connectivity and embedded substrate technology. Attendees will have the opportunity to see how SiP solutions are implemented into a variety of applications, including smart living, connectivity, data management and diagnostic devices in healthcare.
About Universal Scientific Industrial (Shanghai) Co., Ltd.
Universal Scientific Industrial (Shanghai) Co., Ltd. is a global ODM/EMS company providing design, miniaturization, material sourcing, manufacturing, logistics, and after services of electronic devices/modules for brand owners. As a member of ASE Group, USI SH was founded in 2003 and listed in the Shanghai Stock Exchange in 2012. With diversified and balanced offerings, plus sales service network in North America, Europe, Japan, China, Taiwan, as well as manufacturing sites in China, Taiwan and Mexico, USI serves customers in the sectors of wireless communication, computer and storage, consumer, industrial, and automotive electronics worldwide. Visit USI web at www.usish.com.
About ASE, Inc.
ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com or follow us on Twitter: @aseglobal.