Press Room

2017 / 04 / 06

ASE Singapore Receives Common Criteria for Information Technology Security Evaluation Certification

Singapore, April 6th, 2017 – Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX), a leading semiconductor assembly and test service provider, today announced that its Singapore IC testing and backend wafer level chip scale packaging facility has received the Common Criteria certification.

Common Criteria is a framework that outlines the requirements for globally recognized standards and security inspections for IT products. It is designed for products and applications that are targeted for high security-intensive markets, such as the go vernment, banking or defense sectors. ASE Singapore is certified at Evaluation Assurance Level 6, the second highest level of stringency. The Singapore site was evaluated and certified by Bundesamt für Sicherheit in der Informationstechnik (BSI,, which is the central IT security service provider for the German federal go vernment. BSI also offers its services to private and commercial users of information technology.

“To further augment our service offerings in today’s challenging and dynamic information-driven era, we continuously invest in training our employees and upgrading our IT and security infrastructure that will mitigate potential risks in testing and assembling secure products, ” said LJ Chiou, General Manager, ASE Singapore Private Limited. “Customers can be fully assured that their products and information data are handled with a high degree of sensitivity and within the highest level of security at ASE Singapore, ” he continued.

As part of the certification effort, ASE Singapore completely revamped its workplace security access systems, designed and upgraded its building infrastructure to meet the stringent security assurance. These new measures will help identify, secure and provide a systematic level of traceability in the movement of people and go ods inside and around the ASE facilities. ASE now has 4 sites – Chung Li, Taiwan; Kaohsiung, Taiwan, Paju, Korea and Singapore, that are Common Criteria certified. The Common Criteria certification will greatly benefit customers and ASE as both parties would be able to shorten the time needed to verify product security and thus, enable customers’ products to reach their intended markets quickly.

About ISO 15408-EAL6 and the Common Criteria
The Common Criteria for Information Technology Security Evaluation (CC) is an international standard (ISO/IEC 15408) for computer security certification. CC provides assurance that the process of specification, implementation and evaluation of a computer security product has been conducted in a rigo rous and standard and repeatable manner at a level that is commensurate with the target environment for use.

Evaluation Assurance Level (EAL) – the numerical rating describing the depth and rigo r of an evaluation. Each EAL corresponds to a package of security assurance requirements which covers the complete development of a product, with a given level of strictness. Common Criteria lists seven levels (EAL 1 through EAL 7), with EAL 1 being the most basic (and therefore cheapest to implement and evaluate) and EAL 7 being the most stringent (and most expensive).

About ASE Singapore
ASE Singapore is the premier IC testing and backend wafer level chip scale packaging (WLCSP) service provider within the ASE Group of companies. Its location in the Southeast Asian corridor is an excellent gateway to the East Asian, American and European regions, through Singapore’s world class logistics, efficient and business-friendly economic environment. The facility provides engineering testing, wafer probing, final testing, backend WLCSP and logistics management.


About ASE, Inc.

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative VIPack™, advanced packaging, and system-in-package solutions to meet growth momentum across a broad range of end markets, including AI, automotive, 5G, high-performance computing, and more. To learn about our advances in SiP, fanout, MEMS and sensor, flip chip, and 2.5D, 3D and TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: ASE Website , or follow us on LinkedIn & X: @aseglobal.