Press Room

2005 / 08 / 30

Freescale Honors ASE with 2005 Supplier Recognition Award

Santa Clara, California, August 30, 2005 – Advanced Semiconductor Engineering Incorporated (ASE, TAIEX: 2311, NYSE: ASX), the world’s largest semiconductor packaging and test company, announced today that it has received a Supplier Recognition Award from Freescale Semiconductor. ASE was one of three companies presented with Supplier Recognition Awards, honoring suppliers who have significantly impacted Freescale’s business throughout the past 12 months.

Freescale’s annual awards ceremony recognizes global suppliers demonstrating excellent performance in providing value, quality products and services key to its success. Nominations are made by Freescale’s global and regional commodity managers and are based on suppliers’ performance ratings in several catego ries, such as quality, competitiveness, delivery, service and technology. Freescale’s executive team reviews the nominations and makes the final selection of top suppliers.

“This award is our way of recognizing those suppliers who have demonstrated outstanding leadership in their areas of expertise and are considered to be among the very best suppliers to Freescale, ” said Gerry Stewart, strategic sourcing manager for Freescale. “ASE readily accepts the challenge of go ing the extra mile to support our business requirements.”

“Freescale is a valued customer of ASE and it is truly an honor to receive this level of recognition, ” said Dr Tien Wu, President of ASE Americas, Europe, ASE (U.S.) Inc. “This award reflects on our commitment and determination in continuing to strengthen our strategic relationship with Freescale, to act as a seamless extension of its supply chain operations and to contribute to its overall success in the semiconductor industry.”


About ASE, Inc.

ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: or follow us on Twitter: @aseglobal.

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