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2016 / 03 / 18

Inside the OSAT Business: Q&A with ASE (by Mark LaPedus of Semiengineering)

How packaging houses compare to foundries, and what impact consolidation will have on different IC manufacturing segments. BY: MARK LAPEDUS

March 18, 2016 – Semiconductor Engineering sat down to discuss the IC-packaging industry, foundries, China and other topics with Tien Wu, chief operating officer at Taiwan’s Advanced Semiconductor Engineering (ASE), the world’s largest outsourced semiconductor assembly and test (OSAT) vendor. What follows are excerpts of that conversation.

Inside the OSAT Business: Q&A with ASE (by Mark LaPedus of Semiengineering)


 

About ASE, Inc.

ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com or follow us on Twitter: @aseglobal.

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