High Density SMT

The ways to reduce form factor of SiP in X/Y size are utilization of tiny passive components and shrinking distance between components to component. ASE HD-SMT technology by using tiny 01005 SMD and 3 mils component to component distance is ready and in mass production.

To expand more functions in restricted body size of a SiP/module, dual side SMT as well as double sides molding technology is adopted.