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FAQ

Q: Who is Advanced Semiconductor Engineering, Inc. ("ASE Inc.")?
A:

ASE Inc. is the world's leading subcontractor of semiconductor back-end manufacturing services.

We offer complete turnkey services, including IC packaging, IC testing, substrate design and manufacturing, and module assembly.

We are a global corporation with headquarters located in Taipei, Taiwan and manufacturing facilities in 3 continents in close proximity to our blue-chip customers to service their global needs.


Q: How long has ASE Inc. been in business?
A:

ASE Inc. began providing semiconductor assembly services to customers in 1984, and ASE Test started providing semiconductor test services in 1987.


Q: What is ASE Inc’s revenues breakdown?
A:

IC ATM (IC assembly, testing, and material) is the major revenues contributor of ASE Inc. For detailed and latest revenues mix information, please click here.


Q: In which areas of the semiconductor manufacturing process does ASE Inc. compete?
A:

ASE Inc. provides a complete range of services for the back end of the semiconductor manufacturing process, including wafer probe, packaging, development of customized test program and related hardware, burn-in test, final test, dry pack, tape and reel, and drop shipment. The company also manufactures lead frames and substrates that are used as raw material during the packaging process.


Q: Who are ASE Inc.'s competitors?
A:

As a full-service provider, ASE Inc. currently faces competition only in individual segments of the semiconductor manufacturing process, but does not have a direct competitor able to provide the full service solution. Competitors can be grouped in the following areas:As a full-service provider, ASE Inc. currently faces competition only in individual segments of the semiconductor manufacturing process, but does not have a direct competitor able to provide the full service solution. Competitors can be grouped in the following areas:

Front-end Testing: In-house capacity of design houses and integrated device manufacturers (IDMs), etc.

Wafer Probing: IDMs, wafer foundries and other independent testing houses
Assembly/Packaging: Amkor Technology, JCET (Jiangsu Changjiang Electronics Technology, who has acquired STATS ChipPAC) and IDMs, etc.

Final Testing: Amkor Technology, JCET (Jiangsu Changjiang Electronics Technology, who has acquired STATS ChipPAC) and IDMs, etc.

Substrate Manufacturing: Ibiden, Shinko, Unimicron, Kinsus, etc.


Q: What is ASE Inc's fiscal year?
A:

Our fiscal year is the same as our calendar year and ends on December 31.


Q: Does ASE Inc. issue quarterly reports?
A:

To view our webcasts of past quarterly earnings releases, please click here.


Q: How do I get a copy of your Annual Report?
A:

To access our Annual Report online, please click here.


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