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Thermal and Mechanical Characterization of 2.5D and Fan-Out Chip on Substrate Chip-First and Chip-Last Packages

Heterogeneous integration technology makes possible the integration of multiple separately manufactured components into a single higher level assembly with enhanced functionality and improved operating characteristics. Various types of advanced heterogeneous packages are available, including 2.5-D integrated circuit (IC), fan-out chip on substrate (FOCoS) chip-first, and FOCoS chip-last. This study constructs… Read More