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扇出型封裝

Fan-Out packaging continues to gain prominence within the industry, based on significant technical advantages that have led to its broad commercialization. As we move further into the era of system-in-package (SIP) and heterogeneous integration, Fan-Out packaging will become increasingly significant. ASE is evolving this advanced packaging platform to meet application demands for smaller form factors and improved electrical and thermal performance.

What is Fan-Out Packaging?

Literally speaking, “Fan-Out” packaging can be defined as any package with connections fanned-out of the chip surface, enabling more external I/Os. Conventional fan-out packages use an epoxy mold compound to fully embed the dies, rather than placing them upon a substrate or interposer. Fan-Out packaging typically involves dicing chips on a silicon wafer, and then very precisely positioning the known-good chips on a thin “reconstituted” or carrier wafer/panel, which is then molded and followed by a redistribution layer (RDL) atop the molded area (chip and fan-out area), and then forming solder balls on top.

A popular packaging technique now is to build packages with a standard Fan-Out type RDL, but with dies embedded in materials such as organic laminate or silicon wafer instead of the mold compound. Please refer to “Embedded die packaging” for more details.

Fan-Out is a wafer-level packaging (WLP) technology. It is essentially a true chip-scale packaging (CSP) technology since the resulting package is roughly the same size as the die itself. When dealing with shrinking pitch design requirements, Fan-In WLP faces processing challenges as the area available for I/O layout is limited to the die surface. Fan-Out WLP, however, does not have this limitation as the technique allows for the redistribution of I/Os beyond the die surface and onto the over-mold which, in turn supports a thinner package.

ASE Fan-Out Package Offerings

eWLB

BB, RF, Codec, Car Radar

Pkg ~ 12x12
RDL 12/12um
2L RDL
Since 2009

FOCoS

Networking, Server

Pkg ~ 67x67
RDL 2/2um
3L RDL
Since 2016

M-Series

RF, BB, PMIC, Codec

Pkg ~ 12x12
RDL 8/8um
2L RDL
Since 2018

FOPoP

AP & Memory

Pkg ~ 15x15
RDL 5/5um
3L RDL
Since 2016

FOSiP

RF, FEM, Power, MCU

Pkg ~ 15x15
RDL 5/5um
5L RDL
Since 2017

Panel FO

RF, FEM, Power, Server

Pkg ~ 67x67
RDL 2/2um
5L RDL
Since 2019

Engineering/Qualification

eWLB (embedded wafer-level ball-grid array), also known as ASE aWLP: Chip-First, Face-Down, licensed from Infineon.

FOCoS (Fan-Out Chip on Substrate): ASE In-house developed technology.

M-Series: Chip-First, Face-Up, licensed from Deca Technologies.

FOPoP (Fan-Out Package on Package)

FOSiP (Fan-Out System in Package)

Panel FO (Panel level Fan-Out): 300 x 300 mm panels for high-density solution (Chip-Last), 600 x 600 mm panels for low-density solution (Chip-First)

Fan-Out Packaging Applications

Fan-Out packaging is mainly driven by mobile applications, which require high-performace, energy-efficient thin- and small-form-factor packages. Today, fan-out is in high volume applications for a wide variety of products, including PMICs, RF packages, Baseband processors, and high-end networking systems.

New Fan-Out Opportunities for High Frequency:

Automotive Radar (76-81GHz)
5G Backhaul (>20GHz)
5G Fronthaul (>20GHz)
WiGig (60GHz)
Antenna in Package (AiP)

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