English 中文

Wafer Level Packaging

ASE is with solid experience and superior capability to provide a broad range of Wafer Level Package (WLP) solutions from chip scale packages to SiP to homogeneous and heterogeneous chip integration. ASE is able to provide thinnest profile, lower power consumption and high performance solutions.

ASE WLP solution meets current needs in various applications from client device to infrastructure and high performance cloud computing, even emerging appliance such as VR/AR, autonomous driving, smart Robots.

This website uses Cookies to optimize your experience. By choosing to continue, you agree to the use of Cookies and our Cookie Terms. To know more about Cookies and how to enable and disable cookies, please see “How to change Cookie preferences or disable Cookies?” in our Cookie Terms.

Accept Cookies