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MEMS & Sensors Packaging

Micro-Electro-Mechanical Systems (MEMS) and sensors are the essential enabling components that allow people to experience and interact with the world in revolutionary new ways. MEMS devices consist of mechanical elements, sensing features, and electronic circuits integrated onto a common silicon substrate. The elements in MEMS gather information from the environment through the measurement of mechanical, thermal, biological, chemical, acoustic, optical, and magnetic stimuli. Wafer level packaging and TSV technologies are key enabling technologies that optimize size, functionality, performance as well as deliver cost effective integration for MEMS packaging. ASE offers extensive modeling lab capabilities, including optical lab simulation and measurement, as well as expertise in material measurement and stress simulation, which are all areas of extreme importance to MEMS & Sensor manufacturing.



Application
Features

MEMS and sensor's markets are mainly driven by the strong demands from mobile, automotive, and medical applications.

Inertial
  • Gyroscope
  • Accelerometer
  • Magnetometer/Hall Effect
  • Combo & IMU
Light & Radiations
  • X-ray Sensor
  • µ-bolometer
  • IR Sensor
  • IR Thermopile
  • UV Sensor
  • PALS/ALS
RF
  • Oscillators
  • Switches
  • SAW
  • FBAR/BAW
Environmental
  • TPMS Module
  • Gas Sensor
  • Pressure Sensor
  • Temperature Sensor
  • Humidity Sensor
  • Si µphone
Others
  • Optical/µ-mirror
  • LED
  • IJ Head
  • Small size, mass volume
  • Low power consumption
  • Low cost
  • Easy to integrate into systems or modify

 

Wafer Level MEMS

Micro-Electro-Mechanical Systems (MEMS) consists of mechanical elements, sensors, actuators, and electrical and electronics devices on a common silicon substrate. The sensors in MEMS gather information from the environment through measuring mechanical, thermal, biological, chemical, optical, and magnetic phenomena. Wafer level packaging and TSV technology are keys enabling to achieve innovative functions, higher performance as well as cost effective integration.

Reliability

The WL MEMS package with the TSV Last structure was validated with corresponding reliability and electrical characteristics testing.

Test Item Conditions Sample Size Result
Precondition JEDEC 22-A113
MSL1, 85°C/85% RH,168 hours
77 ea Pass
Temperature Cycle JEDEC 22-A104
-55℃ ~ 125℃, 1000 cycles
25 ea Pass
HAST Test (No Bias) JEDEC 22-A118
130℃/85% RH, 33.3 PSIA,96 hours
25 ea Pass
High Temperature
Storage Life
JEDEC 22-A103
150°C, 1000 hours
25 ea Pass



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