MEMS and Sensor Packaging

Micro-Electro-Mechanical Systems (MEMS) and sensors contribute to the myriad semiconductor technologies that allow us to experience and interact with our surroundings in revolutionary new ways. MEMS devices consist of mechanical elements, sensing features and electronic circuits integrated onto a silicon substrate. The elements in MEMS gather information from the environment through the measurement of mechanical, thermal, biological, chemical, acoustic, optical and magnetic stimuli. Wafer level packaging and TSV technologies are key enabling packaging technologies that optimize size, functionality, performance as well as deliver cost effective integration for MEMS packaging. ASE has extensive modeling lab capabilities, including optical lab simulation and measurement, as well as expertise in material measurement and stress simulation. These services are all areas of extreme importance to MEMS & Sensor manufacturing.


MEMS and sensors serve as gears to connect people with their surroundings, and enable deeper perception and interaction to the environment. We are able to leverage the information that sensors perceive to develop functions that improve the quality of life. The rise in robotics, autonomous vehicles, smart homes, IoT, AR/VR/MR, and environmental hubs has become the driving force for the acceleration and development of MEMS and sensor technology.

What is MEMS and Sensors Packaging?

MEMS are a process technology used to create tiny integrated devices or systems that combine mechanical and electrical components. These devices have the ability to sense, control and actuate according to set parameters. While traditional packaging serves to protect chips, MEMS packaging is part of the device function. Each sensor device has unique packaging requirements to meet specific functions for interacting with external devices or the environment. For example, speakers, microphones and pressure sensors must have sound or pressure inlets integrated using MEMS and sensor packaging techniques. Optical devices may require certain types of materials to be used so that the desired optical wavelengths may be detected. MEMS and sensor packages can be further differentiated into mold type, air type with leadframe/organic substrate/ceramic substrate and metal/plastic packages and wafer-level packaging, providing comprehensive solutions for sensor and device protection according to the type of application and the commercial/reliability requirements.

Integrated sensor hub/sensor fusion* has become more and more important in the latest cellphones and wearable devices.
QFN metal oxide gas sensor
LGA metal oxide gas sensor

Advantages of MEMS and Sensors Packaging

The integration of MEMS sensors in chips are used in a diverse array of industries including automotive, consumer and industrial applications. MEMS and Sensor packaging offer advantages such as modularity, high flexibility and reasonably low fabrication complexity with integration of the integrated circuit and micromechanical components. Compared with conventional packaging processes, MEMS and sensor packaging are more application dependent and provide several benefits that include:

Support optically compatible material

  • Clear molding/encapsulation
  • Customized dyed encapsulant
  • Filter coating
  • Silicon or plastic lens and Microlens array

Improve sensor function

  • Optical simulation
  • Hermetic sealing
  • Dedicated assembly methodology

ASE MEMS and Sensors Packaging Offerings

ASE offers a variety of sensor packaging solutions that leverage upon an established database of material properties and assembly experience to address dedicated sensor requirements of different microelectronic, optoelectronic, RF, biomedical device, sensor, actuator and microsystem applications.


Pressure Sensor

  • Pkg~ 7x7
  • MEMS(accelerometer & pressure), MCU integration
  • Since 2014

OCQFN (Open Cavity Quad Flat No-lead):

  • Cost-efficient and mature packaging
  • Also suitable for gas sensor, emitter/receiver


Ambient Light Sensor

  • Pkg~ 2x2
  • Support consumer, automotive application
  • Since 2016

OQFN (Optical Quad Flat No-lead):

  • Transparent molding compound is available
  • Also suitable for gesture sensor, emitter/receive



  • Pkg~ 1.5x1
  • MEMS oscillator
  • Since 2017

CoW (Chip on Wafer):

  • Also suitable for silicon photonics, imaging sensor


Proximity Sensor

  • Pkg~ 2.5x1.5
  • ALS, color, gesture integration
  • Since 2015

OLGA (Optical Land Grid Array):

  • Assembly of proprietary plastic panel
  • Clear molding
  • Customized molding lens
  • Also suitable for bio sensor, ToF* sensor, imaging sensor



  • Pkg~ 5x5
  • Molded fence with cover
  • Automotive grade reliability
  • Since 2015

PMQFN (Pre-mold Quad Flat No-lead):

  • Semi-hermetic
  • Also suitable for illuminator capable of fall-off detection, LiDAR receiver, emitter


Fingerprint Sensor

  • Pkg~ 16x6
  • Collimator integration
  • Dispensed/Molded encapsulant
  • Since 2016

iLGA (image Land Grid Array):

  • Wafer-level collimator/lens
  • Strip-level filter coating
  • Also suitable for LiDAR imaging, CMOS image sensor

Key Growth for MEMS and Sensors Applications


  • Smartphone
  • Wearable device
  • AR/VR/MR
  • Medical & Biometrics


  • Automotive
  • ADAS & Autonomous system
  • Robotics & Automation
  • Industry 4.0


  • High Performance Computing
  • 5G/IoT/Environmental hubs
  • Artificial Intelligence & Machine Learning