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In order to ensure the performance of high-frequency fan-out package design, especially at mmWave application, the influence of substrate dielectric characteristic is very serious. Polyimide (PI) material is common material used in Fan-out package. The moisture effect of PI is very obvious in stress and electrical performance. Sso this paper… Read More
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5G communication has been widely implemented since year 2020, especially for FR1 sub-6GHz range. Band n77, n78 and n79 are three critical bands in the 5G FR1 because of higher frequency and much wider bandwidth – This also brings new challenge on filter design. In this work, we propose a… Read More
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在這個充滿挑戰與未知多變的時代中，令人期待的是從健康到交通、從機器人技術到人工智慧、從邊緣到雲端、從 5G 到未來，半導體產業的變革創新正實現許多真正改變生活品質與效率的應用，創造更智慧、更永續的明天。 日月光為半導體微型化與整合開創出新道路，持續創新提供先進封裝以及系統級封裝SiP解決方案，以滿足汽車、5G通信、人工智慧、物聯網、高效能運算(HPC)等應用需求。 我們提供多樣SiP 解決方案，並推出 VIPack™先進封裝平台，提供垂直互連整合封裝解決方案。VIPack™是日月光擴展設計規則並實現超高密度和性能設計的下一世代3D異質整合架構。此平台利用先進的重佈線層(RDL)製程、嵌入式整合以及2.5D/3D封裝技術，協助客戶在單個封裝中整合多個晶片來實現前所未有的創新應用。簡而言之，VIPack™以多層堆疊重佈線層(RDL)封裝結構實現異質整合。 日月光VIPack™ 解決諸多關鍵領域元件挑戰，如插入損耗、整合挑戰、時脈/速度、高度、功率傳輸和密集的输出/入(IO)等，特別是手機、高效能運算、網絡和射頻應用。 VIPack™由六大核心封裝技術组成，透過全面性整合的生態系統協同合作，包括日月光基於高密度RDL的Fan Out Package-on-Package (FOPoP)、Fan Out Chip-on-Substrate (FOCoS)、Fan Out Chip-on-Substrate-Bridge (FOCoS-Bridge) 和 Fan Out System-in-Package (FOSiP)，以及基於矽通孔 (TSV) 的 2.5D/3D IC 和 Co-Packaged Optics。除了提供可優化時脈速度、頻寬和電力傳輸的高度整合矽封裝解決方案所需的製程能力，VIPack™平台更可縮短共同設計時間、產品開發和上市時程，其中包括雙面 RDL/ Fan Out、RDL 整合被動元件、高度密集佈線、先進封裝材料以及 DTC 整合。 VIPack™ 擁有許多具高性能的子封裝平台或ABF/基板佈線的替代解決方案，可以為大多數市場應用區塊提供解方其。VIPack™可擴展最先進的封裝技術藍圖，並且具有顯著的成本效益和性能優勢。 現今先進的晶圓節點正在突破功率傳輸的極限，因此雜訊和性能在整體電源管理時至關重要。VIPack™提供了一套可針對多個市場應用區塊的封裝解決方案，旨在為這些挑戰提供解決方案並擴展先進封裝技術藍圖。 歡迎您與我們討論 VIPack™ 先進封裝平台解決方案！ 更多詳細資訊，請瀏覽aseglobal.com/ch/vipack… Read More
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Heterogeneous integration technology makes possible the integration of multiple separately manufactured components into a single higher level assembly with enhanced functionality and improved operating characteristics. Various types of advanced heterogeneous packages are available, including 2.5-D integrated circuit (IC), fan-out chip on substrate (FOCoS) chip-first, and FOCoS chip-last. This study constructs… Read More
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The demand for high bandwidth and high-performance applications such as networking, AI computing and GPU IC chips are driving innovative developments in advanced IC packaging. Heterogeneous integration enables the integration of multiple chips using fine line/space interconnect packaging technology. Heterogeneous integration packaging solutions offered in the market today include, through… Read More
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In recent years, Fan-Out (FO) packages have become widely used in handheld, mobile consumer and internet of things (IoT) devices. FO packaging allows greater I/O density as well as the ability to pack multiple components in the same package compared to conventional wafer level chip scale package (WLCSP). Several types… Read More
