This is posts with tag name "Fan-Out Packaging"

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Advanced Packaging from FOWLP to FOPLP Development of FanOut Chip Last in 300 mm Panel

As the demand for high-performance computing (HPC) continues to rise, processor designs are evolving towards chiplet integration and ASIC-HBM architectures, leveraging high-density interconnection technologies. While wafer-level fan-out packaging (FOWLP) has become a widely adopted solution, it faces challenges such as warpage control, complex processes, and carrier utilization limitations. To address… Read More

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Fine-Line RDL Structure Analysis of Fan-Out Chip-on-Substrate Platform

The demand for high bandwidth memory (HBM) has driven the need for advanced packaging solutions, particularly those involving fan-out layers to interconnect wafers within packages. To meet the high-bandwidth requirements of the Fan-Out Chip-on-Substrate (FOCoS) technology platform, additional layers are required. However, as the number of fanout layers increases, significant… Read More

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Integrated Design Ecosystem™ for Chiplets and Heterogeneous Integration in Advanced Packaging Technology

As the demand for high-performance computing (HPC) continues to grow, chiplets and heterogeneous integration have emerged as key solutions due to their significant advantages in improving yield, reusing IP, enhancing performance, and optimizing costs. The integration of chiplets, particularly for AI applications, necessitates a greater number of connections than traditional… Read More

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AI and Semiconductor in Reciprocity

In today’s rapidly advancing technological era, AI has become a powerful catalyst for innovation and progress. Advanced semiconductor packaging plays a crucial role in supporting AI development, while AI applications create new semiconductor demands and drives the development of semiconductor technologies, with both complementing each other. Semiconductor Packaging: The Bridge… Read More

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Dk/Df Extraction and Moisture Effect on mmWave Fan-out Package Design

In order to ensure the performance of high-frequency fan-out package design, especially at mmWave application, the influence of substrate dielectric characteristic is very serious. Polyimide (PI) material is common material used in Fan-out package. The moisture effect of PI is very obvious in stress and electrical performance. So this paper… Read More

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Thermal and Mechanical Characterization of 2.5D and Fan-Out Chip on Substrate Chip-First and Chip-Last Packages

Heterogeneous integration technology makes possible the integration of multiple separately manufactured components into a single higher level assembly with enhanced functionality and improved operating characteristics. Various types of advanced heterogeneous packages are available, including 2.5-D integrated circuit (IC), fan-out chip on substrate (FOCoS) chip-first, and FOCoS chip-last. This study constructs… Read More

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2.5D vs Fan-out Chip on Substrate

The demand for high bandwidth and high-performance applications such as networking, AI computing and GPU IC chips are driving innovative developments in advanced IC packaging. Heterogeneous integration enables the integration of multiple chips using fine line/space interconnect packaging technology. Heterogeneous integration packaging solutions offered in the market today include, through… Read More