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Advanced Packaging from FOWLP to FOPLP Development of FanOut Chip Last in 300 mm Panel
As the demand for high-performance computing (HPC) continues to rise, processor designs are evolving towards chiplet integration and ASIC-HBM architectures, leveraging high-density interconnection technologies. While wafer-level fan-out packaging (FOWLP) has become a widely adopted solution, it faces challenges such as warpage control, complex processes, and carrier utilization limitations. To address… Read More