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As the increasingly demand of computer, communication and consumer electronics in recent years, flip-chip ball grid array (FCBGA) with ajinomoto build-up film (ABF) substrate is major package for performance request. But if we consider performance, substrate resource, and cost, alternative package structure is need to replace FCBGA. Hence, two alternative… Read More
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High-performance products including 5G mobile communication, network server and AI require big data transmission, data rate increase and broader bandwidth. In this paper, the novel bridge die package will be discussed in terms of electrical performance. Two RDL layers based on bridge die package will be analyzed by routing design… Read More
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在這個充滿挑戰與未知多變的時代中，令人期待的是從健康到交通、從機器人技術到人工智慧、從邊緣到雲端、從 5G 到未來，半導體產業的變革創新正實現許多真正改變生活品質與效率的應用，創造更智慧、更永續的明天。 日月光為半導體微型化與整合開創出新道路，持續創新提供先進封裝以及系統級封裝SiP解決方案，以滿足汽車、5G通信、人工智慧、物聯網、高效能運算(HPC)等應用需求。 我們提供多樣SiP 解決方案，並推出 VIPack™先進封裝平台，提供垂直互連整合封裝解決方案。VIPack™是日月光擴展設計規則並實現超高密度和性能設計的下一世代3D異質整合架構。此平台利用先進的重佈線層(RDL)製程、嵌入式整合以及2.5D/3D封裝技術，協助客戶在單個封裝中整合多個晶片來實現前所未有的創新應用。簡而言之，VIPack™以多層堆疊重佈線層(RDL)封裝結構實現異質整合。 日月光VIPack™ 解決諸多關鍵領域元件挑戰，如插入損耗、整合挑戰、時脈/速度、高度、功率傳輸和密集的输出/入(IO)等，特別是手機、高效能運算、網絡和射頻應用。 VIPack™由六大核心封裝技術组成，透過全面性整合的生態系統協同合作，包括日月光基於高密度RDL的Fan Out Package-on-Package (FOPoP)、Fan Out Chip-on-Substrate (FOCoS)、Fan Out Chip-on-Substrate-Bridge (FOCoS-Bridge) 和 Fan Out System-in-Package (FOSiP)，以及基於矽通孔 (TSV) 的 2.5D/3D IC 和 Co-Packaged Optics。除了提供可優化時脈速度、頻寬和電力傳輸的高度整合矽封裝解決方案所需的製程能力，VIPack™平台更可縮短共同設計時間、產品開發和上市時程，其中包括雙面 RDL/ Fan Out、RDL 整合被動元件、高度密集佈線、先進封裝材料以及 DTC 整合。 VIPack™ 擁有許多具高性能的子封裝平台或ABF/基板佈線的替代解決方案，可以為大多數市場應用區塊提供解方其。VIPack™可擴展最先進的封裝技術藍圖，並且具有顯著的成本效益和性能優勢。 現今先進的晶圓節點正在突破功率傳輸的極限，因此雜訊和性能在整體電源管理時至關重要。VIPack™提供了一套可針對多個市場應用區塊的封裝解決方案，旨在為這些挑戰提供解決方案並擴展先進封裝技術藍圖。 歡迎您與我們討論 VIPack™ 先進封裝平台解決方案！ 更多詳細資訊，請瀏覽aseglobal.com/ch/vipack… Read More
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Heterogeneous integration technology makes possible the integration of multiple separately manufactured components into a single higher level assembly with enhanced functionality and improved operating characteristics. Various types of advanced heterogeneous packages are available, including 2.5-D integrated circuit (IC), fan-out chip on substrate (FOCoS) chip-first, and FOCoS chip-last. This study constructs… Read More
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The demand for high bandwidth and high-performance applications such as networking, AI computing and GPU IC chips are driving innovative developments in advanced IC packaging. Heterogeneous integration enables the integration of multiple chips using fine line/space interconnect packaging technology. Heterogeneous integration packaging solutions offered in the market today include, through… Read More
