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As the increasingly demand of computer, communication and consumer electronics in recent years, flip-chip ball grid array (FCBGA) with ajinomoto build-up film (ABF) substrate is major package for performance request. But if we consider performance, substrate resource, and cost, alternative package structure is need to replace FCBGA. Hence, two alternative… Read More
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High-performance products including 5G mobile communication, network server and AI require big data transmission, data rate increase and broader bandwidth. In this paper, the novel bridge die package will be discussed in terms of electrical performance. Two RDL layers based on bridge die package will be analyzed by routing design… Read More
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There are still many unknowns as we continue through challenging global times. However, it is inspiring to see such game-changing innovation within the semiconductor industry, ultimately enabling applications that are literally changing lives, from health to transportation, from robotics to AI, from edge to cloud, from 5G to beyond. Collectively,… Read More
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Heterogeneous integration technology makes possible the integration of multiple separately manufactured components into a single higher level assembly with enhanced functionality and improved operating characteristics. Various types of advanced heterogeneous packages are available, including 2.5-D integrated circuit (IC), fan-out chip on substrate (FOCoS) chip-first, and FOCoS chip-last. This study constructs… Read More
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The demand for high bandwidth and high-performance applications such as networking, AI computing and GPU IC chips are driving innovative developments in advanced IC packaging. Heterogeneous integration enables the integration of multiple chips using fine line/space interconnect packaging technology. Heterogeneous integration packaging solutions offered in the market today include, through… Read More
