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As the demand for high-performance computing (HPC) continues to grow, chiplets and heterogeneous integration have emerged as key solutions due to their significant advantages in improving yield, reusing IP, enhancing performance, and optimizing costs. The integration of chiplets, particularly for AI applications, necessitates a greater number of connections than traditional… Read More
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In today’s rapidly advancing technological era, AI has become a powerful catalyst for innovation and progress. Advanced semiconductor packaging plays a crucial role in supporting AI development, while AI applications create new semiconductor demands and drives the development of semiconductor technologies, with both complementing each other. Semiconductor Packaging: The Bridge… Read More
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In chiplet integration applications, various chips from different vendors can be integrated into one package structure using the Universal Chiplet Interconnect Express (UCIe) standard. Fan-Out Chip on Substrate (FOCoS) is a promising advanced package that can achieve high channel density and high bandwidth. However, crosstalk in high-speed signals is a… Read More
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The world is rapidly transitioning from an internet economy to an AI economy. In the internet economy, we stayed constantly connected to the internet 24/7 through our smartphones, PCs, and IoT devices. However, in the AI economy, every aspect of our lives are interwoven with artificial intelligence. You may already… Read More
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High density fan-out-chip-on-substrate-embedded bridge (FOCoS-Bridge) technology has been successfully built on a large chip module incorporated ten (10) chiplets and ten (10) silicon (Si) bridge dies with more than three times (3X) silicon reticle size. One of the most difficult aspects of this large body size is the chip on… Read More
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As the increasingly demand of computer, communication and consumer electronics in recent years, flip-chip ball grid array (FCBGA) with ajinomoto build-up film (ABF) substrate is major package for performance request. But if we consider performance, substrate resource, and cost, alternative package structure is need to replace FCBGA. Hence, two alternative… Read More
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High-performance products including 5G mobile communication, network server and AI require big data transmission, data rate increase and broader bandwidth. In this paper, the novel bridge die package will be discussed in terms of electrical performance. Two RDL layers based on bridge die package will be analyzed by routing design… Read More
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There are still many unknowns as we continue through challenging global times. However, it is inspiring to see such game-changing innovation within the semiconductor industry, ultimately enabling applications that are literally changing lives, from health to transportation, from robotics to AI, from edge to cloud, from 5G to beyond. Collectively,… Read More
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Heterogeneous integration technology makes possible the integration of multiple separately manufactured components into a single higher level assembly with enhanced functionality and improved operating characteristics. Various types of advanced heterogeneous packages are available, including 2.5-D integrated circuit (IC), fan-out chip on substrate (FOCoS) chip-first, and FOCoS chip-last. This study constructs… Read More
