Heterogeneous integration of increasingly smaller devices packaged with higher functionality
Since miniaturization and function integration became inevitable trend in semiconductor packaging industry, as a pioneer of OSAT, ASE Group has developed worldwide leading System in Package (SiP) technologies combining high density surface mount technology (HD-SMT), ultra-thin molding, irregular forming and RF shielding technologies to meet demand from our customers. Rather than generic IC packaging technologies, development of SiP requires heterogeneous integration of single or multiple chips, surface mount device (SMD) resistor/capacitor/inductor, filters, connectors and other active/passive components. The following results of SiP provide smaller form factor module to reduce body size of electronic products as well as more functions in a module to fit more complete application of end device. Moreover, comparing with single chips assembly on PCB, utilization of SiP reduces design complexity and provides easy SKU management. It shortens time to market and reduces total development cost.