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Heterogeneous integration of increasingly smaller devices packaged with higher functionality

Since miniaturization and function integration became inevitable trend in semiconductor packaging industry, as a pioneer of OSAT, ASE Group has developed worldwide leading System in Package (SiP) technologies combining high density surface mount technology (HD-SMT), ultra-thin molding, irregular forming and RF shielding technologies to meet demand from our customers. Rather than generic IC packaging technologies, development of SiP requires heterogeneous integration of single or multiple chips, surface mount device (SMD) resistor/capacitor/inductor, filters, connectors and other active/passive components. The following results of SiP provide smaller form factor module to reduce body size of electronic products as well as more functions in a module to fit more complete application of end device. Moreover, comparing with single chips assembly on PCB, utilization of SiP reduces design complexity and provides easy SKU management. It shortens time to market and reduces total development cost.

The ways to reduce form factor of SiP in X/Y size are utilization of tiny passive components and shrinking distance between components to component. ASE HD-SMT technology by using tiny 01005 SMD and 3 mils component to component distance is ready and in mass production.

To expand more functions in restricted body size of a SiP/module, dual side SMT as well as double sides molding technology is adopted.
Application
Features
  • Phone/Tablet
  • Wearable Device
  • Glasses, Camera
  • IoT/Smart Home Electronics
  • Car System
  • One side or dual side SMT
  • Ultra-high accuracy pick & place
  • Ultra-high SPI & AOI for yield insurances

Capabilities
  • 01005 component MP, 008004 ready
  • 6-layer 0.185mm substrate in mass production
  • Minimum 3 mils component to component distance
ASE provides an advanced module encapsulation technology, called the double-side molded module technology. It solves the old single-sided molded technology in the back of the region only the electrical connection of the waste space, thereby achieving the purpose of module miniaturization.
Application
Features
Miniaturization module especially in WiFi and RF
Both sides of the substrate are molded with PMC, in the back central area of the placement and around the use of substrate interposer for electrical connection, ultimately connected to the motherboard IPAD using Film mold technology.

Capabilities
  • Size saving: 10 ~ 40 %
  • Pad Pitch: >= 0.4mm
  • MUF capability is the same single side molded
Module Level
Pre-con (L3) TCT-1000 HAST-264 HTST-1000
Passed Passed Passed Passed
Board Level
Drop Test Function
Passed Passed
ASE provides an advanced module encapsulation technology, called the selective molded module technology. It can solve the sensitivity components cannot put in over molded issue, but also allows the end product space design has greater flexibility.
Application
Features
Miniaturization module especially in WiFi and RF.
On the same side of the substrate, there are both an mold area and a open area.

Capabilities
  • Clearance of open area: > 0.3mm
  • Clamp width between mold area and open area: > 0.6mm
  • Clamp width between open area and package side line: > 0.6mm
Module Level
Pre-con (L3) TCT-1000 HAST-264 HTST-1000
Passed Passed Passed Passed
Board Level
Drop Test Function
Passed Passed
ASE had introduced a novel conformal shielding technology (CFS) for electromagnetic interference (EMI) prevention, against external interference, keep chip normal working. For thinner, smaller and lighter product, PVD CFS technology was designed to substitute for metal can/lid. The technology was widely applied in wireless communication, ex: RF, Bluetooth, WiFi, etc.
Application
Features
  • Phone/Tablet
  • Wearable Device
  • Glasses
  • Camera
  • Car System
CPS technology was prevented package to package and outer signal interference. Developed advanced PVD process replaced metal can/lid to reach product miniaturization, area reduction 17% and thickness reduction 7%.

Capabilities
ASE developed PVD CFS technology was reached over 99.9% (SE value > 30dB) EMI impact in 0.5 to 6GHz frequency when metal layer thickness over 3um.
ASE had introduced a new, EMI compartment shielding (CPS) structure which was constructed from laser trench and conductive paste. The technology is designed to provide better shielding performance in more compact structure. The distinctive characteristics of CPS technology (Laser trench/Conductive paste filling) are flexible and customized design for high-integration module. This offers customers much more aggressive layout design, and also high-level EMI shielding performance for sensitive components/chipset. In addition, CPS technology enables the smaller form factor of modules which is needs of wearable device, mobile device, and IoT application.
Application
Features
  • Phone/Tablet
  • Wearable Device
  • Glasses
  • Camera
  • Car System
  • Higher EMI shielding performance
  • Highly flexible and customized shielding pattern design
  • Thinner, compact shielding barrier (~150um)
  • Mold base compartment shielding solution

Capabilities
Structure:
  • Trench opening width (top/bottom): 400um/80um
  • Shielding performance (S.E.): 45~50dB (1GHz – 6GHz)
Antenna on Package (AoP) is a new approach to minimize the antenna size at the package level, which not only can provide the smallest antenna, but also a highly integrated RF SiP module to reduce the difficulty at the system level.
Application
Features
AoP technology allows much more applications in mobile device and wireless communication, such as 2.4GHz BLE in BT4.2 and future BT5.0, WiHD in IEEE 802.15.3c, WiGig in IEEE 802.11ad. In addition, AoP technology enables the advanced 3D patterning on package that addresses the need in the challenging 77GHz for car radar and 94GHz for imaging.
AoP technology is designed to provide a good radiation performance with the low insertion loss and good impedance matching between the RF SiP and the antenna. Base on a completed material and process database system in ASE, the electromagnetic simulation can be performed for different customer requested conditions. The key to realize the optimum design into a successful AoP product is through the powerful 3D patterning ability on a conformal and good quality metal film.

Capabilities
ASE concentrates on advanced 3D patterning developing with high accuracy control and high automation throughput and these unique capabilities include:

  • Min. package size: 4.9mm x 3.3mm (achieved at 2.4GHz)
  • Film step coverage: >30%
  • Min. line/space on top: 250μm
  • Dimension tolerance on side wall: within +/-35um
ASE provides an advanced encapsulation technology, called the flexible encapsulation technology. It enhances the wearable products in the waterproof function: products can still be bent after encapsulation.
Application
Features
Wearable electrical product including clothes, glasses, watches, bracelets, and rings.
This technology uses a special flexible sealant material with a soft board (FPC) so that the module can be bending in the end product after module assembly.


Capabilities
Test Item Test Condition Duration Results
TCT -55°C~85°C 100 cycles Passed
Bending 30°C 100 cycles Passed
Twist twist span 45mm, angle 5~30 degrees 100 cycles Passed