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Press Center
About ASE
Heterogenous Integration
VIPack™
Advanced RDL Packaging
2.5D and 3D IC Packaging
FOCoS
FOCoS-Bridge
FOPoP
Silicon Photonics
System-in-Package
SiP Overview
Double Side Molding
Fan-Out SiP
3D SiP
Antenna in Pacakge
Embedded Die Substrate
MEMS and Sensor Packaging
Other Packaging
Leadframe Packaging
Wire Bond BGA
Flip Chip Packaging
Wafer Level Packaging
Fan-Out Packaging
Bumping
Other Services
Test Services
Packaging Substrate
Package Design
Substrate Design
Lab Services
Overview
5G/6G
HPC
AI
Smart Automotive
Smart City
Smart Home
Smart Factory
Smart Wearables
Smart Hearables
Sustainability Drives the Future
Green Actions
Green Building
Green Manufacturing & Circular Economy
Water Reclamation
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Social Inclusion
Environmental Education
Employee Care
Sustainability Leadership
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Smart Manufacturing
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