Press Room

NEWS
2020 / 12 / 03

ASE hosts Industry-Academia Forum on Environmental Technology to explore Social Development Goals

Kaohsiung, Taiwan – ASE hosted a forum on Environmental Technology on December 3rd in conjunction with the TASS Asia’s Sustainable Supply and Circular Economy exhibition and conference.

This is the sixth year of ASE’s industry-academia collaboration on environmental technology research and covers a wide spectrum of research including water, waste, air quality and noise pollution. The collaboration has resulted in 8 special projects that align environmental research with corporate sustainability topics. At the forum, practical experience and research highlights were shared with attendees from the universities, industry and environmental groups. Among the presentations were the introduction of an intelligent monitoring system to control the coagulant dosing in wastewater treatment, NMP photochemistry pre-treatment, and an air pollution emission risk management system.

‘Environmental issues are a core business concern for ASE. We combine the strengths of the industry, academia and local communities to develop suitable technologies that aid in ASE’s sustainable transformation in factory manufacturing as well as our efforts to achieve the United Nations Sustainable Development Goals (SDG),’ says KC Chou, Senior Vice President, ASE Kaohsiung. ‘In addition, we work closely with suppliers to realize circular projects through mutual trust and beneficial cooperation. This helps to strike a balance between economic and environmental sustainability as well as create a better society,’ he added.


 

About ASE, Inc.

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative VIPack™, advanced packaging, and system-in-package solutions to meet growth momentum across a broad range of end markets, including AI, automotive, 5G, high-performance computing, and more. To learn about our advances in SiP, fanout, MEMS and sensor, flip chip, and 2.5D, 3D and TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: ASE Website , or follow us on LinkedIn & X: @aseglobal.