Substrate Design

As customers are demanding small, thin, and high-performance for their electronic products, device makers are searching for high-performance, high-reliability, and low-cost solutions. Substrate/lead frame has played a very important role in packaging industry, not only because it represents a great portion of the cost, but also because it has a great influence on package performance. How to design a high-performance, low-cost substrate/lead frame has become one of the major tasks in all packaging companies. In ASE, we have a group of experienced professional dedicate in substrate/lead frame design in order to provide turnkey solutions for our customers to fulfill high-performance, cost saving and short time to market.

Function & Service

Design Tool

The characteristics of packaging material are a major concern when determining how well the ICs will perform. ASE's Material Laboratory provides the characterization analysis of the following properties. The related instruments are listed next. Users can find more information from the Measurement Equipment section.