Smart Automotive
Explore ASE's suite of products and services that will power your automotive applications with higher reliability, integration and efficiency.
ASE’s semiconductor packaging and test technology is enabling new generations of smart vehicles with higher levels of safety, comfort and convenience. The automotive market is also moving away from gas guzzling and air polluting vehicles, to more energy efficient electric vehicles. We are working closely with automotive customers to integrate packaging technologies into sensors - image sensors, environment sensors and controllers to manufacture chips that can intelligently learn, analyze and communicate information to perform different functions and save energy.
Safety
Leadframe
Wafer Level
MEMS & Sensors
Module
Advanced
IMU
ADAS
Leadframe
Wire Bond
Flip Chip
MEMS & Sensors
Module
Advanced
IMU
Body
Leadframe
Wire Bond
MEMS & Sensors
Module
Advanced
IMU
Infotainment
Leadframe
Wafer Level
MEMS & Sensors
Module
Advanced
IMU
Chassis
Leadframe
Wire Bond
Wafer Level
MEMS & Sensors
Module
Advanced
IMU
EV/HEV
Leadframe
Wire Bond
MEMS & Sensors
Module
Advanced
IMU
IGBT + Coupler
Instrumentation
Wire Bond
Wafer Level
Flip Chip
MEMS & Sensors
Module
Advanced
Powertrain
Leadframe
Wire Bond
MEMS & Sensors
Module
Advanced
IMU
Aftermarket
Leadframe
Wire Bond
Flip Chip
MEMS & Sensors
Module
Advanced