Smart Automotive

Explore ASE's suite of products and services that will power your automotive applications with higher reliability, integration and efficiency.

ASE’s semiconductor packaging and test technology is enabling new generations of smart vehicles with higher levels of safety, comfort and convenience. The automotive market is also moving away from gas guzzling and air polluting vehicles, to more energy efficient electric vehicles. We are working closely with automotive customers to integrate packaging technologies into sensors - image sensors, environment sensors and controllers to manufacture chips that can intelligently learn, analyze and communicate information to perform different functions and save energy.

Smart Automotive
Safety
ADAS
Body
Infotainment
Chassis
EV/HEV
Instrumentation
Powertrain
Aftermarket

Safety

Airbag Control

Airbag – Facial Recognition

Side Airbag Sensor

Anti-lock

Electronic Stability Control

TPMS

LiDAR

Radar

Leadframe
Wafer Level
MEMS & Sensors
Module
Advanced
IMU

ADAS

ADAS Control Module

LiDAR

Radar

Electronic Stability Control

Ultrasonic

Active Suspension

Night Vision

AI Co-pilot

Leadframe
Wire Bond
Flip Chip
MEMS & Sensors
Module
Advanced
IMU

Body

Climate Control

Ultrasonic

LiDAR

Radar

VOC, Alcohol Sensor

Engine Oil Pressure

Electronic Stability Control

Side Airbag

Leadframe
Wire Bond
MEMS & Sensors
Module
Advanced
IMU

Infotainment

Fixed Navigation Systems

Audio Head Units

Airbag – Facial Recognition

Infotainment Head Units

Rear Seat Entertainment

Seat Occupant Sensor

VOC, Alcohol Sensor

LiDAR

Display Control for Map – Proximity & Gesture

Leadframe
Wafer Level
MEMS & Sensors
Module
Advanced
IMU

Chassis

Tire Pressure Monitoring

Electronic Stability ControlEngine Oil

Pressure

Steering

Anti-lock Braking

Active Suspension

Speed from Tire Rotation

Brake/Accelerator Pedals

Leadframe
Wire Bond
Wafer Level
MEMS & Sensors
Module
Advanced
IMU

EV/HEV

Electric Drive Controller

Electronic Stability Control

Air Intake

Battery Management

Active Suspension

Inverter

EV Charging Station

Leadframe
Wire Bond
MEMS & Sensors
Module
Advanced
IMU
IGBT + Coupler

Instrumentation

Head-up Display

Display Dimming

Finger Print Sensor

Instrument Cluster

Display Control for Map – Proximity & Gesture

Camera – Driver Monitoring, Collision Detection, Sign Reading

Wire Bond
Wafer Level
Flip Chip
MEMS & Sensors
Module
Advanced

Powertrain

Engine Control Module

Transmission Control Module

Diesel Engine Exhaust gas recirculation (EGR)

Engine Oil Pressure

Air Intake

Electronic Stability Control

Leadframe
Wire Bond
MEMS & Sensors
Module
Advanced
IMU

Aftermarket

Portable Navigation Devices

Video Recorders

Audio Head Units

Rain Sensor

Infotainment Head Unit

Head-up Display

VOC, Alcohol Sensor

Airbag – Facial Recognition

Leadframe
Wire Bond
Flip Chip
MEMS & Sensors
Module
Advanced

Quality and Safety Are Essential for Automotive Applications

ASE provides a comprehensive one-stop manufacturing service from wafers to packages to modules, and offer cost effective turnkey solutions for rapid time-to-market. We have long-term partnerships with global tier-one automotive suppliers and most of our sites meet a wide range of automotive standards, including IATF16949, ISO26262, ISO21434, VDA6.1, 6.3 and 6.5 as well as achieve AEC-Q100, AEC-Q006 Grade 0+ requirement. We also have value added based on compliance with cyber security and safety standards such as ISO 27001, and EAL 6. This greatly shortens the time needed for product verification and thus, enable customers' products to reach their intended markets quickly.

Quality and Safety Are Essential for Automotive Applications

ASE provides a comprehensive one-stop manufacturing service from wafers to packages to modules, and offer cost effective turnkey solutions for rapid time-to-market. We have long-term partnerships with global tier-one automotive suppliers and most of our sites meet a wide range of automotive standards, including IATF16949, ISO26262, ISO21434, VDA6.1, 6.3 and 6.5 as well as achieve AEC-Q100, AEC-Q006 Grade 0+ requirement. We also have value added based on compliance with cyber security and safety standards such as ISO 27001, and EAL 6. This greatly shortens the time needed for product verification and thus, enable customers' products to reach their intended markets quickly.