Smart Wearables

ASE is an industry leader in the heterogeneous integration and design of packaging solutions that packs an array of high performance chips onto a small form factor, achieving high performance and reducing power consumption.

From fitness trackers, smart watches, smart earphones to VR/AR headsets, wearables have become an integral part of our life. These devices are changing how we communicate, and how data is monitored and shared to improve user experiences.

As more functions are packed into wearable products, design and development in integrating power management devices, sensors, and microcontrollers within a limited space remain a huge challenge. ASE is enabling chip packaging designs to push the boundaries in creating sleeker and smarter wearables.

Smart Watch & Wristband

Components
Packaging Solutions
Microcontroller Unit or Application/Baseband Processor
WLCSP, FOPoP
Connectivity (Wi-Fi, BLE, GNSS, 5G)
WLCSP, SiP
Memory (DRAM, Flash)
BGA. WLCSP
MEMS Sensor (HR Sensor, IMU, Ambient light Sensor, Pressure Sensor)
WLCSP, QFN, LGA
Power (PMIC, Wireless Charging)
WLCSP, OFN

Smart Hearables

Components
Packaging Solutions
Microcontroller Unit
WLCSP, QFN
Audio Processing (Audio Codec, Noise Cancellation)
WLCSP, QFN
Connectivity (BLE Audio SoC)
QFN, BGA, WLCSP
Memory (NOR Flash)
WLCSP, QFN
MEMS Sensor (MEMS Microphone, Ambient Light Proximity, Accelerometer)
SiP, QFN, LGA
Power (PMIC, Wireless Charging)
WLCSP, OFN

Smart Glasses & VR/AR Headsets

Components
Packaging Solutions
Application Processor
Flip Chip BGA
Connectivity (Wi-Fi, BLE, GNSS, 5G)
WLCSP, SiP
Memory (DRAM, Flash)
BGA. WLCSP
MEMS Sensor (Temperature Sensor, IMU, Ambient light Sensor)
WLCSP, QFN, LGA
Power (PMIC, Wireless Charging)
WLCSP, OFN