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Die Bonding Solution for Flip Chip-Chip Scale Package-DIC (Digital Image Correlation) and Shadow Moiré Application
The 5th Generation wireless systems popularity will push the package development into a high performance and heterogeneous integration form. Electronic products will be thinner and smaller, high-speed, high I/O density and other characteristics. So Bump diameter and Bump pitch design will gradually become smaller or narrower to meet the bump… Read More
