About ASE

Leader in Outsourced Semiconductor Assembly and Test (OSAT)

The ASE Group (Advanced Semiconductor Engineering Inc) is the leading provider of independent semiconductor manufacturing services in assembly and test. ASE develops and offers complete turnkey solutions in IC packaging, design and production of interconnect materials, front-end engineering test, wafer probing and final test. The company is the primary architect of Heterogeneous Integration (HI), a technology platform that integrates complex components into a System-in-Package (SiP) to deliver superior performance.

Our Capabilities

Semiconductor manufacturing consists of many processes - design of the integrated circuit (IC), preliminary testing of the viability of the design, wafer fabrication, packaging and final testing of the IC. ASE’s capabilities include:

Front-end engineering test. The testing of semiconductor prototypes before they go into volume production. Our services include software development, electrical verification, reliability analysis and failure analysis.

Wafer probing. A process whereby each individual die (chip) on the wafer is tested for any defects before they are processed further.

Packaging (also known as assembly). The processing of bare semiconductors into finished semiconductors, serving to protect the die and facilitate electrical connections and heat dissipation. ASE offers a broad range of semiconductor packages and System-in-Package (SiP) solutions that meet the diverse function and cost requirements of customers.
Learn more about our Advanced Packaging Technologies and IC Packaging Services

Final testing. A process that ensures that each semiconductor chip functions properly before being shipped to customers or assembled in electronic products.

State-of-the-art Process Technologies

The increasing complexity of the integrated chip has posed much challenges to the manufacturing process as chip designers continue to pack more functions onto a smaller chip, while demanding better performance, speed and lower power consumption, all at a lower cost. In keeping with the advances in chip development and market demands, ASE maintains a highly experienced and skilled engineering team that continuously research and develop the latest assembly technologies.

Our technology and manufacturing strengths cover processes that include Cu Wire Bonding, Wafer Bumping, Cu Pillar Bumping, Flip Chip Packaging, Wafer Level Chip Scale Packaging (WLCSP) and System in Package (SiP), MEMS & Sensor Packaging, Fan Out, 2.5D/3D IC Packaging, Green Packaging and 300mm turnkey backend solutions.

Innovation and quality are values that ASE prides itself in delivering leading-edge technologies and solutions to customers, and meeting their demanding requirements such as electrical performance, heat dissipation, cost and aggressive cycle time. We continue to invest prudently in the latest equipment and state-of-the-art facilities, making us a true extension of our customers’ manufacturing operations.