Leader in Outsourced Semiconductor Assembly and Test (OSAT)
The ASE Group (Advanced Semiconductor Engineering Inc) is the leading provider of independent semiconductor manufacturing services in assembly and test. ASE develops and offers complete turnkey solutions in IC packaging, design and production of interconnect materials, front-end engineering test, wafer probing and final test. The company is the primary architect of Heterogeneous Integration (HI), a technology platform that integrates complex components into a System-in-Package (SiP) to deliver superior performance.
Semiconductor manufacturing consists of many processes - design of the integrated circuit (IC), preliminary testing of the viability of the design, wafer fabrication, packaging and final testing of the IC. ASE’s capabilities include:
Front-end engineering test. The testing of semiconductor prototypes before they go into volume production. Our services include software development, electrical verification, reliability analysis and failure analysis.
Wafer probing. A process whereby each individual die (chip) on the wafer is tested for any defects before they are processed further.
Packaging (also known as assembly). The processing of bare semiconductors into finished semiconductors, serving to protect the die and facilitate electrical connections and heat dissipation. ASE offers a broad range of semiconductor packages and System-in-Package (SiP) solutions that meet the diverse function and cost requirements of customers.
Learn more about our Advanced Packaging Technologies and IC Packaging Services
Final testing. A process that ensures that each semiconductor chip functions properly before being shipped to customers or assembled in electronic products.