All around us, digital transformation is changing the way we live, work, play and communicate. As a leading provider of semiconductor packaging and test services, ASE is proud to have played a significant role in upholding Moore’s Law and applying our technology on many of the world’s most innovative electronics. Our technologies have also enabled our customers to create cutting edge products that deliver superior performance, power, speed and connectivity.
Year Established
Member of the ASE Technology Holding Company Ltd
(TWSE: 3711, NYSE: ASX)
Established First 5G mmWave Smart Factory
Number of Employees Worldwide
Number of Smart Factories
ASE is a primary architect of Heterogeneous Integration (HI) - the technology that integrates separately manufactured components into a higher level assembly (System-in-Package or SiP) that in the aggregate provides enhanced functionality and improved operational characteristics.
HI is now the key technology in the advancement of integrated systems for greater intelligence and connectivity, higher bandwidth and performance, and lower latency and power per function, all at a more manageable cost. To learn more about ASE Heterogeneous Integration click here and SiP click here.
Market shifts in customer requirements as well as the advent of 5G wireless technologies have given rise to smart manufacturing and the acceleration of Industry 4.0 at ASE. Smart Factories represent the future of our industry and are an integral part of ASE’s business operations. Our strategy is to leverage on AI, Big Data and Smart Automation to achieve full digital transformation. We are moving ahead of our time by harnessing the power of smart manufacturing to increase productivity, add more value to the supply chain and strive for near perfection. To learn more about ASE Smart Factories, click here.
Technology can make a better world and this belief has fueled our ambition to lead the industry in corporate sustainability through innovation, social, economic and environmental stewardship. We are focused on implementing robust policies that combat climate change, advance green technologies and manufacturing, promote a strong economy and serve public interests. In December 2020, we were listed on both the CDP Climate A and Water A lists whilst in November 2021, we achieved the best overall performance on the Dow Jones Sustainability Indices (DJSI) – Semiconductors and Semiconductor Equipment Industry Group. ASE has remained on the DJSI World List for the sixth consecutive year, demonstrating our commitment to the fundamentals of our ESG principles and sustainability mission. To learn more about ASE Corporate Sustainability, click here.
Automation, heterogeneous integration in machine and production systems, and heterogeneous integration in systems-in-package (SiP) are 3 major forces driving smart factories and digital transformation at ASE. Our strong foundation in automation coupled with the successful integration of upstream and downstream partners in the use of digital technologies have resulted in greater customer trust.
We are involved in many stages of the semiconductor manufacturing process - front-end engineering test, wafer probing, IC package design, substrate design and manufacturing, IC packaging (assembly), final test as well as module, board assembly and test in collaboration with our sister company, USI.
