ASE Kaohsiung is ASE's flagship operation, housing the Group's R&D center and operating world-class assembly, wafer bumping and test services. ASE Kaohsiung provides full turnkey services, including substrate design and manufacturing capabilities.
ASE Kaohsiung offers a vast range of package assembly and testing services, wafer sort testing and final testing service, as well as substrate design and manufacturing.
ASE ChungLi, ASE Group's Intelligent Industrial Park, offers total turnkey services, including IC packaging, testing and substrate manufacturing. Located in the heart of Taiwan's major foundry clusters next to the HsinChu Scientific Park. ASE ChungLi has extensive experience in the field of wireless communications and provides image sensor and punched QFN capabilities to leading-edge applications.
ASE ChungLi offers package design and assembly, module assembly and testing, and substrate manufacturing.
ASE Shanghai, strategically located in Shanghai's Zhangjiang High-Tech Park, provides semiconductor industry with integral ability of IC design, assembly & Test, wafer probing and final test. It provides an excellent one stop shop service for both domestic and global customers.
ASE Shanghai's main package offerings include BGA, CSP, and QFP featuring traditional wire bonding and advanced fine pitch technology. ASE Shanghai's test technology supports all types of testing, and encompasses analog, logic and mixed signal as well as provides test development software and services for customers.
ASE Shanghai Material, established in Shanghai's Zhangjiang High Tech Park, is with professional IC substrate production experience and innovative R&D to deliver competitive integrated design and production services to semiconductor industry customers worldwide.
Substrate design and production for PBGA, TFBGA, BOC, fcCSP, Memory, and SiP Module.
ASE Kunshan is strategically located in Yanhu Industry Park in Kunshan Jiangsu province. ASEKS with overall land space of 1,073,998 square meters, is to provide the integrated for ASE’s assembly, test, substrate and board assembly manufacturing capabilities.
ASE Kunshan offers SO, PDIP, QFN, QFP and BGA packages featuring traditional wire bonding and advanced fine pitch technology.
ASEN was established as the Joint Venture of ASE and NXP in 2007, located in the Suzhou Industrial Park (SIP), Southern China, ASEN is owned by ASE Group since March, 2018. ASEN is strategically placed to serve the rapidly growing global semiconductor industry assembly & test market.
ASEN focuses on mobile communications and is expected to expand into other segments in the future. To meet customer needs, ASEN will offer a variety of package types, such as low pin count QFN, LFBGA, SO, TSSOP and other common packages for mobile applications.
ASE acquired Wuxi Tongzhi Microelectronics Co., Ltd. from TOSHIBA Semiconductor (Wuxi) Co., Ltd. to strengthen the capability of ASE for providing IC assembly and testing services in China.
ASE Wuxi specializes in QFP, LQFP, SOP and PDIP for household appliance, communications and amusement application.
ASE Weihai, acquired Aimhigh's manufacturing facility in 2008, located in Wei Hai city, Shandong, China, specializes in lower pin count products. ASE Weihai offers significant cost advantages for discrete product manufacturing.
ASE Weihai focuses on discrete, providing packaging & test for communication, consumer & computer application ICs.
ASE Korea, located close to many handset and home appliance manufacturers, has established itself as a leader in RF, automotive and telecom analog, as well as MEMS sensor device package and test.
ASE Korea offers assembly and test services of sensor, communications, wireless and automotive semiconductors.
ASE Japan, acquired NEC Electronics' packaging and testing operation in Japan as part of our aggressive globalization strategy, allowing ASE to gain a foothold in Japan. ASE Japan focuses on BGAs, QFPs, as well as IC test services.
ASE Japan offers assembly and test services of BGA type, and Leaded type.
ASE Malaysia, located in the heart of ASEAN cluster, serves a large customer base in the communications, computing, industrial and automotive markets. Through highly automated manufacturing processes and state-of-the-art equipment, ASE Malaysia has developed capabilities to assemble and test packages such QFPs, TQFPs, BGAs, SOICs, SOJs, PDIPs and camera modules.
ASE Malaysia provides package assembly and test in the field of communications, consumer electronics, industrial and industrial markets.
ASE Singapore, formerly ISE Labs, is noted for its expertise in front-end test and wafer sort, and works closely with ASE Malaysia to form a total semiconductor manufacturing supply chain from front-end testing to backend IC packaging and test. It is in close proximity to the integrated device manufacturers and fabless companies in Hong Kong and Southeast Asia (also known as the ASEAN Cluster).
Test development, wafer probe and packaged IC test services , and possesses vast experience in mixed-signal and RF testing through a range of sophisticated test platforms .
ISE Labs has a wealth of experience and expertise to serve the semiconductor community. Our wide breadth of engineering services and products include test engineering support, production test services, test program development, test interface and reliability test hardware, ESD, burn-in, environmental testing, mechanical testing, and failure analysis.
Offers front-end engineering and final testing services of ICs.
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