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  • On Mar 25, the People’s Republic of China’s Anti-Monopoly Bureau lifted the restrictive conditions imposed on the establishment of ASEH.
  • On April 30, ASE Technology Holding was listed on the Taiwan Stock Exchange (TWSE code: 3711) and on the New York Stock Exchange (NYSE code: ASX).
  • On February 12, ASE and SPIL announced that ASE Industrial Holding (now known as ASE Technology Holding) would hold 100% of the equity interests of both ASE and SPIL.
  • In June, ASE and SPIL jointly announced an agreement to establish a new holding company through mutual share exchanges.
  • ASE and TDK established the ASE Embedded Electronics Inc at Kaohsiung, Taiwan to offer SESUB® (semiconductor embedded in substrate) module technology that enables semiconductor miniaturization for portable and wearable electronic devices.
  • In October, the ASE water recycling plant began operations at the Kaohsiung Nantze Export Processing Zone.

  • Celebrated the ASE Group's 30th anniversary.

  • Acquired Wuxi Tongzhi Microelectronics Co, Ltd from Toshiba to expand ASE's IC assembly and testing service offerings in China.

  • Universal Scientific Shanghai, a subsidiary of Universal Scientific Co. Ltd., completed its IPO on the Shanghai Stock Exchange on February 2012.
  • ASE Korea and the city of Paju signed an MOU for the further development of ASE's communication IC packaging and testing production facilites in the industrial zone.

  • Operation began at ASE K12, the world’s first semiconductor assembly and test facility to be awarded the double distinction of EEWH Diamond and LEED Platinum certifications.

  • Acquired EEMS Test Singapore Pte Ltd to further strengthen ASE Singapore's test offerings.
  • Acquired Universal Scientific Industrial Co, Ltd to provide a complete IC manufacturing service portfolio from chip-level assembly and testing to board-level PCB/module assembly.
  • ASE Kunshan officially in operation. The strategically located facility at the Yanhu Industrial Park, Kunshan, Jiangsu province provides assembly, test, substrate and board assembly manufacturing capabilities.

  • Started volume production of Copper Wire Bonding at ASE manufacturing sites.

  • Acquired Aimhigh's manufacturing facility located in Wei Hai city, Shandong, China specializing in discrete IC packaging.

  • ASEN, an IC assembly and testing facility was jointly established by ASE and NXP in Suzhou, China.
  • Integrated GAPT Shanghai into the ASE Group and renamed ASE Assembly & Test (Shanghai) Ltd.

  • Transferred existing semiconductor material business department to its wholly owned subsidiary, ASE Electronics Inc., to strengthen core competencies and to further develop material business.
  • ASE and Powerchip formed joint venture to establish PowerASE Technology Inc, focusing on packaging and test services for the memory IC market.

  • Started volume production of Wafer Level CSP (WLCSP).
  • Acquired NEC Electronics' IC packaging and testing operation in Takahata, Japan. The acquisition enabled ASE to enhance its presence and market share with Japanese IDM (Integrated Device Manufacturers) customers.
  • Established substrate and IC module manufacturing facilities in Shanghai, China.

  • Celebrated the ASE Group’s 20th anniversary.

  • ASE IC Assembly, Test and Materials surpassed all players in the OSAT industry to achieve global market leadership.

  • Established ASE ChungLi Intelligent Industrial Park to provide comprehensive turnkey services under one roof in Northern Taiwan.
  • Completed development and opened facility to handle 300mm wafer bumping.

  • ASE Inc. started trading on the New York Stock Exchange through the issue of ADR.
  • Commenced volume production of flip chip packaging.

  • ASE Test Limited listed on NASDAQ, becoming the first Taiwan-based company to make a public offering in the US.
  • Acquired Motorola's manufacturing facilities in Chungli, Taiwan and Paju, Korea.
  • Obtained controlling interest in Universal Scientific Industrial Co., Ltd. (USI), expanding into the scope of systems assembly.

  • ASE Test Limited started trading on Taiwan Stock Exchange through the issue of TDR.
  • Established in-house flip chip assembly and test capabilities.

  • Incorporated ASE Material Inc. to establish in-house inter-connection materials (substrates) capabilities.

  • Established packaging and testing facilities in Penang, Malaysia.

  • Entered the semiconductor test market by acquiring ASE Test Limited.

  • ASE Inc began trading on the Taiwan Stock Exchange.
  • Brothers Jason Chang and Richard Chang established Advanced Semiconductor Engineering, Inc. Operations began at its first factory in Kaohsiung, Taiwan.

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