On April 30, ASE Technology Holding was listed on the Taiwan Stock Exchange (TWSE code: 3711) and whose American depositary shares listed on the New York Stock Exchange (NYSE code: ASX).
On February 12, ASE and SPIL announced on interim shareholders meeting that under the joint share exchange agreement, ASE Industrial Holding would be established that would hold 100% of the equity interests of both ASE and SPIL.
In June, ASE and SPIL jointly announced that each party’s respective board of directors has adopted resolution to approve the entering into and execution of a joint share exchange agreement between ASE and SPIL and agreement to establish a new holding company.
ASE and TDK established the ASE Embedded Electronics Inc at
Kaohsiung, Taiwan to offer SESUB® (semiconductor embedded in substrate) module technology that enables semiconductor miniaturization for portable and wearable electronic devices.
In October, the ASE water recycling plant began operations at the Kaohsiung Nantze Export Processing Zone.
Celebrated the ASE Group's 30th anniversary.
Acquired Wuxi Tongzhi Microelectronics Co, Ltd from Toshiba to expand ASE's IC assembly and testing service offerings in China.
Universal Scientific Shanghai, a subsidiary of Universal Scientific Co. Ltd., completed its IPO on the Shanghai Stock Exchange on February 2012.
ASE Korea and the city of Paju signed an MOU for the further development of ASE's communication IC packaging and testing production facilites in the industrial zone.
Operation began at ASE K12, the world’s first semiconductor assembly and test facility to be awarded the double distinction of EEWH Diamond and LEED Platinum certifications.
Acquired EEMS Test Singapore Pte Ltd to further strengthen ASE Singapore's test offerings.
Acquired Universal Scientific Industrial Co, Ltd to provide a complete IC manufacturing service portfolio from chip-level assembly and testing to board-level PCB/module assembly.
ASE Kunshan officially in operation. The strategically located facility at the Yanhu Industrial Park, Kunshan, Jiangsu province provides assembly, test, substrate and board assembly manufacturing capabilities.
Started volume production of Copper Wire Bonding at ASE manufacturing sites.
Acquired Aimhigh's manufacturing facility located in Wei Hai city, Shandong, China specializing in discrete IC packaging.
ASEN, an IC assembly and testing facility was jointly established by ASE and NXP in Suzhou, China.
Integrated GAPT Shanghai into the ASE Group and renamed ASE Assembly & Test (Shanghai) Ltd.
Transferred existing semiconductor material business department to its wholly owned subsidiary, ASE Electronics Inc., to strengthen core competencies and to further develop material business.
ASE and Powerchip formed joint venture to establish PowerASE Technology Inc, focusing on packaging and test services for the memory IC market.
Started volume production of Wafer Level CSP (WLCSP).
Acquired NEC Electronics' IC packaging and testing operation in Takahata, Japan. The acquisition enabled ASE to enhance its presence and market share with Japanese IDM (Integrated Device Manufacturers) customers.
Established substrate and IC module manufacturing facilities in Shanghai, China.
Celebrated the ASE Group’s 20th anniversary.
ASE IC Assembly, Test and Materials surpassed all players in the OSAT industry to achieve global market leadership.
Established ASE ChungLi Intelligent Industrial Park to provide comprehensive turnkey services under one roof in Northern Taiwan.
Completed development and opened facility to handle 300mm wafer bumping.
ASE Inc. started trading on the New York Stock Exchange through the issue of ADR.
Commenced volume production of flip chip packaging.
ASE Test Limited listed on NASDAQ, becoming the first Taiwan-based company to make a public offering in the US.
Acquired Motorola's manufacturing facilities in Chungli, Taiwan and Paju, Korea.
Obtained controlling interest in Universal Scientific Industrial Co., Ltd. (USI), expanding into the scope of systems assembly.
ASE Test Limited started trading on Taiwan Stock Exchange through the issue of TDR.
Established in-house flip chip assembly and test capabilities.
Incorporated ASE Material Inc. to establish in-house inter-connection materials (substrates) capabilities.
Established packaging and testing facilities in Penang, Malaysia.
Entered the semiconductor test market by acquiring ASE Test Limited.
ASE Inc began trading on the Taiwan Stock Exchange.
Brothers Jason Chang and Richard Chang established Advanced Semiconductor Engineering, Inc. Operations began at its first factory in Kaohsiung, Taiwan.