Milestones
1984
Brothers Jason Chang and Richard Chang established Advanced Semiconductor Engineering, Inc. Operations began at its first factory in Kaohsiung, Taiwan.
1989
ASE Inc began trading on the Taiwan Stock Exchange.
1990
Entered the semiconductor test market by acquiring ASE Test Limited.
1991
Established packaging and testing facilities in Penang, Malaysia.
1998
ASE Test Limited started trading on Taiwan Stock Exchange through the issue of TDR.
Established in-house flip chip assembly and test capabilities.
1999
ASE Test Limited listed on NASDAQ, becoming the first Taiwan-based company to make a public offering in the US.
Acquired Motorola's manufacturing facilities in Chungli, Taiwan and Paju, Korea.
Obtained controlling interest in Universal Scientific Industrial Co., Ltd. (USI), expanding into the scope of systems assembly.
2000
ASE Inc. started trading on the New York Stock Exchange through the issue of ADR.
Commenced volume production of flip chip packaging.
2001
Established ASE ChungLi Intelligent Industrial Park to provide comprehensive turnkey services under one roof in Northern Taiwan.
Completed development and opened facility to handle 300mm wafer bumping.
2003
ASE IC Assembly, Test and Materials surpassed all players in the OSAT industry to achieve global market leadership.
2004
Acquired NEC Electronics' IC packaging and testing operation in Takahata, Japan. The acquisition enabled ASE to enhance its presence and market share with Japanese IDM (Integrated Device Manufacturers) customers.
Established substrate and IC module manufacturing facilities in Shanghai, China.
2005
Started volume production of Wafer Level CSP (WLCSP).
2008
Acquired Aimhigh's manufacturing facility located in Wei Hai city, Shandong, China specializing in discrete IC packaging.
2009
Started volume production of Copper Wire Bonding at ASE manufacturing sites.
2010
Acquired EEMS Test Singapore Pte Ltd to further strengthen ASE Singapore's test offerings.
Acquired Universal Scientific Industrial Co, Ltd to provide a complete IC manufacturing service portfolio from chip-level assembly and testing to board-level PCB/module assembly.
ASE Kunshan officially in operation. The strategically located facility at the Yanhu Industrial Park, Kunshan, Jiangsu province provides assembly, test, substrate and board assembly manufacturing capabilities.
2011
Operation began at ASE K12, the world’s first semiconductor assembly and test facility to be awarded the double distinction of EEWH Diamond and LEED Platinum certifications.
2013
Acquired Wuxi Tongzhi Microelectronics Co, Ltd from Toshiba to expand ASE's IC assembly and testing service offerings in China.
2015
ASE and TDK established the ASE Embedded Electronics Inc at Kaohsiung, Taiwan to offer SESUB® (semiconductor embedded in substrate) module technology that enables semiconductor miniaturization for portable and wearable electronic devices.
In October, the ASE water recycling plant began operations at the Kaohsiung Nantze Export Processing Zone.
2016
In June, ASE and SPIL jointly announced an agreement to establish a new holding company through mutual share exchanges.
2018
On February 12, ASE and SPIL announced that ASE Industrial Holding (now known as ASE Technology Holding) would hold 100% of the equity interests of both ASE and SPIL.
On April 30, ASE Technology Holding was listed on the Taiwan Stock Exchange (TWSE code: 3711) and on the New York Stock Exchange (NYSE code: ASX).
2020
On Mar 25, the People’s Republic of China’s Anti-Monopoly Bureau lifted the restrictive conditions imposed on the establishment of ASEH.
