2.5D and 3D IC Packaging
As 5G, AI, and high-performance computing continue to make inroads into our world, there’s escalating demand for semiconductor devices that deliver enhanced performance, lower latency, increased bandwidth and power efficiency. 2.5D & 3D technologies deliver that, and more. ASE continues to push boundaries by innovating the 2.5D & 3D technologies that are becoming more and more crucial within the industry. ASE has well-established itself as a leader in 2.5D technology, having successfully delivered pioneering 2.5D solutions that helped bring advanced ASIC and HBM products to the market place. To continue this technology innovation momentum, ASE is introducing high density Fan Out technology for die stacking & multi-die solutions to achieve high bandwidth & high performance across the market landscape, addressing demand from high density data centers to consumer & mobile space.