Embedded Die Substrate

ASE's Embedded (Chip) Technology is considered an alternative solution to achieve higher level integration with multi-functionalities and form factor shrinkage advantages. ASE a-EASI is suitable for power electronics applications to reduce power loss and high thermal dissipation which also had robust mechanism. Embedded Technology provides SMT integration and flexible routing solution to reduce PCB size. The short connection path though Cu via structure. a-EASI applied metal lead frame to die placement which has high thermal dissipation and EMI benefit.

Reliability

Key embedded chip technology will be copper via on die pad, Cu pad on die provided good connection structure, both of bare Cu pad or polyimide layer cover Cu. Compare with traditional lead frame package solution, a-EASI is the solution for low loss and high thermal performance requirement. In high current output, the power efficiency still achieves more than 90%.

SESUB (Semiconductor Embedded in SUBstrate) is a technology that embeds the IC in the laminated substrate. This substrate with the thinned IC embedded can be mounted with various electronic components to form a highly integrated, multiple function module/package. SESUB enables the micro-modularization of functional circuitry such as high-performance PMUs for smartphones as well as Bluetooth modules. SESUB has already been a proven technology by many customers and IC vendors.