MEMS and Sensor Packaging

What is MEMS and Sensors Packaging?

MEMS are a process technology used to create tiny integrated devices or systems that combine mechanical and electrical components. These devices have the ability to sense, control and actuate according to set parameters. While traditional packaging serves to protect chips, MEMS packaging is part of the device function. Each sensor device has unique packaging requirements to meet specific functions for interacting with external devices or the environment. For example, speakers, microphones and pressure sensors must have sound or pressure inlets integrated using MEMS and sensor packaging techniques. Optical devices may require certain types of materials to be used so that the desired optical wavelengths may be detected. MEMS and sensor packages can be further differentiated into mold type, air type with leadframe/organic substrate/ceramic substrate and metal/plastic packages and wafer-level packaging, providing comprehensive solutions for sensor and device protection according to the type of application and the commercial/reliability requirements.

Integrated sensor hub/sensor fusion* has become more and more important in the latest cellphones and wearable devices.

QFN metal oxide gas sensor

LGA metal oxide gas sensor

ASE MEMS and Sensors Packaging Offerings

ASE offers a variety of sensor packaging solutions that leverage upon an established database of material properties and assembly experience to address dedicated sensor requirements of different microelectronic, optoelectronic, RF, biomedical device, sensor, actuator and microsystem applications.

LiDAR Receiver Packaging Offerings

ASE offers advanced sensor solutions for the automotive industry, in particular the application of LiDAR (light detection and ranging) remote sensing technology in autonomous vehicles. LiDAR sensors measure distances and scan the environment with a high level of accuracy. Conventional LiDAR sensors can send out infrared light, and measure the time it takes for the light to bounce off an object and back to the sensor, creating a three-dimensional map. In addition to the spatial coordinates (distance), advanced LiDAR such as Frequency Modulated Continuous Wave (FMCW) LiDAR can further determine the reflectivity* and speed of the object (5D). The 3D or 5D maps provide information that allows autonomous vehicles to react promptly and take preventive measures in different traffic scenarios. Our packaging solutions support mechanically spinning LiDAR or solid-state LiDAR using avalanche photodiode (APD), single photon avalanche photodiode (SPAD) or silicon photomultiplier (SiPM).

CoW LGA

CoW for compound semiconductor & CMOS ROIC integration, spacer for interference immune, glass sealing process, bandpass filter on glass, wire coating

QFN

Pre-mold flat lead-frame, plastic lid with glass cover, semi-hermetic sealing

OLGA

CoW for compound semiconductor & CMOS ROIC integration, double plastic lid for particle resistance, bandpass filter on glass