MEMS & Sensors Packaging

MEMS & Sensors Packaging

Micro-Electro-Mechanical Systems (MEMS) and sensors are the essential enabling components that allow people to experience and interact with the world in revolutionary new ways. MEMS devices consist of mechanical elements, sensing features, and electronic circuits integrated onto a common silicon substrate. The elements in MEMS gather information from the environment through the measurement of mechanical, thermal, biological, chemical, acoustic, optical, and magnetic stimuli. Wafer level packaging and TSV technologies are key enabling technologies that optimize size, functionality, performance as well as deliver cost effective integration for MEMS packaging. ASE offers extensive modeling lab capabilities, including optical lab simulation and measurement, as well as expertise in material measurement and stress simulation, which are all areas of extreme importance to MEMS & Sensor manufacturing.

Wafer Level MEMS

Micro-Electro-Mechanical Systems (MEMS) consists of mechanical elements, sensors, actuators, and electrical and electronics devices on a common silicon substrate. The sensors in MEMS gather information from the environment through measuring mechanical, thermal, biological, chemical, optical, and magnetic phenomena. Wafer level packaging and TSV technology are keys enabling to achieve innovative functions, higher performance as well as cost effective integration.