MEMS and Sensor Packaging

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Micro-Electro-Mechanical Systems (MEMS) and sensors contribute to the myraid semiconductor technologies that allow us to experience and interact with our surroundings in revolutionary new ways. MEMS devices consist of mechanical elements, sensing features and electronic circuits integrated onto a silicon substrate. The elements in MEMS gather information from the environment through the measurement of mechanical, thermal, biological, chemical, acoustic, optical and magnetic stimuli. Wafer level packaging and TSV technologies are key enabling packaging technologies that optimize size, functionality, performance as well as deliver cost effective integration for MEMS packaging. ASE has extensive modeling lab capabilities, including optical lab simulation and measurement, as well as expertise in material measurement and stress simulation. These services are all areas of extreme importance to MEMS & Sensor manufacturing.

Introduction

MEMS and sensors serve as gears to connect people with their surroundings, and enable deeper perception and interaction to the environment. We are able to leverage the information that sensors perceive to develop functions that improve the quality of life. The rise in robotics, autonomous vehicles, smart homes, IoT, AR/VR/MR, and environmental hubs has become the driving force for the acceleration and development of MEMS and sensor technology.

Different Types of Sensors

Inertial

Gyroscope
Accelerometer
Magnetometer/Hall-Effect Sensor
Combo & IMU

Light & Radiations

X-ray Sensor
Bolometer
IR Sensor
IR Thermopile
UV Sensor
PALS/ALS
LiDAR

RF

Oscillators
Switches
SAW Filters
FBAR/BAW Filters

Environmental

TPMS Module
Gas Sensor
Pressure Sensor
Temperature Sensor
Humidity Sensor
Si Microphone

Others

Optical/micromirror
LED
Ultrasonic Sensor
Medical Sensor

Advantages of MEMS and Sensors Packaging

The integration of MEMS sensors in chips are used in a diverse array of industries including automotive, consumer and industrial applications. MEMS and Sensor packaging offer advantages such as modularity, high flexibility and reasonably low fabrication complexity with integration of the integrated circuit and micromechanical components. Compared with conventional packaging processes, MEMS and sensor packaging are more application dependent and provide several benefits that include:

Support optically compatible material