loading
English 中文

System-in-Package (SiP)

 

The drive towards semiconductor miniaturization and integration is rapidly unleashing the power and potential of System-in-Package (SiP), a package or module containing a functional electronic system or sub-system that is integrated and miniaturized through IC assembly technologies. ASE is the leader in System-in-Package (SiP) technologies from design to assembly and high volume manufacturing while serving a broad spectrum of applications and markets. With attributes that deliver higher performance, cost effectiveness, and shorter time to market, SiP technology is enabling functionality and creating opportunity across limitless electronics applications.

What is System-in-Package (SiP)?

ASE defines SiP as a package or module that contains a functional electronic system or subsystem that is integrated and miniaturized through IC assembly technologies. Rather than generic IC packaging technologies, development of SiP requires heterogeneous integration of single or multiple chips (such as a specialized processor, DRAM, flash memory), surface mount device (SMD) resistor/capacitor/inductor, filters, connectors, MEMS device, sensors, other active/passive components and pre-assembled package or subsystem.

Enabling Technologies

ASE’s SiP solutions leverage upon established IC assembly capabilities including copper wiring, flip chip packaging, wafer level packaging, fan-out wafer level packaging, 2.5D/3D IC and embedded chip packaging to address ongoing trends in mobile, IoT (Internet of Things), high performance computing, automotive, and artificial intelligence.

Shielding
Conformal Shielding
Compartment Shielding
• Selective Shielding
• Magnetic shielding

Interconnection
• Cap Wire Bond
• Wire Bond
Flip Chip

Die / Package Stacking
2.5D
• Die Thinning/Stacking
Package on Package
Package in Package

Antenna
Antenna on Package
• Antenna in Package

Encapsulation
Double Side Molding
Selective Molding
Flexible Encapsulation
• Molded Underfill
• Irregular Packaging

Wafer Level Package
Wafer Bumping
Cu Pillar
Fan-out WLP
Wafer Level IPD
Wafer Level MEMS

Embedded Substrate
SESUB
a-EASI

Board Assembly
High Density SMT
• ACF Bonding
• Wire Bond on Flex
• Laser Welding
• Flex Bending

ASE SiP Technologies

Shielding
Conformal Shielding
Compartment Shielding
• Selective Shielding
• Magnetic shielding

Antenna
Antenna on Package
• Antenna in Package

Encapsulation
Double Side Molding
Selective Molding
Flexible Encapsulation
• Molded Underfill
• Irregular Packaging

Board Assembly
High Density SMT
• ACF Bonding
• Wire Bond on Flex
• Laser Welding
• Flex Bending

ASE SiP Technologies (continued)

Interconnection
• Cap Wire Bond
• Wire Bond
Flip Chip

Die / Package Stacking
2.5D
• Die Thinning/Stacking
Package on Package
Package in Package

Wafer Level Package
Wafer Bumping
Cu Pillar
Fan-out WLP
Wafer Level IPD
Wafer Level MEMS

Embedded Substrate
SESUB
a-EASI

 

Turnkey Solution

ASE offers customers complete SiP manufacturing capability including system design, software development, module testing and electrical heat transfer simulation technology to enable smaller, higher performance, lower power consumption and more cost effective end products.

System Co-Design
• SiP Electronic Design Automation (EDA) solution
• RF Circuit design
• Antenna Design
• Shielding Solution
• Substrate Layout design

Packaging Consultancy
• Package selection & configuration
• Design rule guideline
• Process capability
• Reliability verification

System Test Consultancy
• RF Wafer probing
• RF ATE Platform
• EVB design & fabrication
• Testing tooling design
• Final test solution development

System-in-Package Intelligent Design (SiP-id)

SiP-id stands for System-in-Package – Intelligent Design. The solution consists of an enhanced reference flow that includes IC packaging and verification tools from Cadence, and a new methodology that aggregates the requirements of wafer-, package- and system-level design into a unified and automated flow. By deploying the SiP-id methodology, chip designers can reduce design iterations and greatly improve throughput as compared to existing advanced packaging EDA tools. The end result is a vast reduction in the time needed to design and verify ultra-complex SiP packages.

It is our intention to offer all ASE customers a set of efficient tools where designers can freely experiment with designs which can go beyond the current packaging limits. This set of design tools are available to eligible customers immediately. However, some of the proprietary libraries and design rules will be subject to an agreement with ASE. It is our belief that IoT, AI, VR, AR, EV and all future applications will demand more SiPs and modules. This is an ongoing effort by ASE, not only to develop fanout (such as Fan-Out Chip on Substrate, FOCoS), panel fanout, embedded substrates, 2.5D, but also to making design tools more user friendly, up-to-date and efficient.

What is required to start a package design with SiP-id, DRC deck is required for fan-out design and 3D DRC deck, for SiP design. The customer can engage our in-house engineering to begin the process.

 

System-in-Package Applications

SiP solutions are highly adopted by end customers for applications including wireless communication, computer storage, power and sensor. In addition, ASE SiP solutions enable a wide range of smart applications including smart living, smart bike, smart city, smart automotive and smart hearables. Advanced SMT, encapsulation, shielding as well as interconnection assembly technologies are developed to meet future requirement arised from 5G communication, AR/VR sensing, and health caring applications.

Wireless SiP Module
Computing Storage SiP Module
Sensor & Optical SiP Module

BT/BLE+MCU SiP Module

Applications

  • Remote Control
  • Health, Fitness and Medical Devices
  • Home Automation, Energy

Features

  • 2.4 GHz BLE transceiver
  • ARM®sup> Cortex – M0 32 bit processor
  • 256 kb embedded flash program memory
  • 16 kb RAM
  • Dimension: 6.5x6.5x1.2mm
  • Package: AoP, LGA

 

WLAN+MCU SiP Module

Applications

  • IoT
  • Smart Home
  • Security
  • Energy Harvesting

Features

  • Dimension: LGA 11x11mm²
  • Structure: FC+W/B
  • WiFi 11b/g + 32bit MCU (50MHz)
  • 128kb flash + 512kb EEPROM
  • Protection: molding, conformal shielding

 

LoRa/SigFox/NB-IoT SiP Module

Applications

  • Wireless Alarm and Security Systems
  • Internet of Things (IoT)
  • Smart City

Features

  • SX1276 transceiver
  • Intel 32MHz Quark MCU
  • DSP for sensor subsystem
  • Worldwide LoRa ISM band embedded
  • 384 kb of on-die NVM+8 kb OTP on-die NVM
  • 80kb of on-die SRAM
  • Dimension: 12x12x1.3mm
  • Package: Conformal shielding, WLCSP

 

SSD SiP Module

Applications

  • Notebook
  • Tablet

Features

  • Dimension: 22x42x1.8mm
  • Structure: Double sided structure in single sided NGFF card thickness
  • Protection: Molding
  • Capacity: NAND flash, 120GB/240 GB

 

Sensor SiP Module

Applications

  • Physiological Signal Sensing

Features

  • Structure: Optical molding + EDS
  • LED x 3pcs + photo-die x 1pcs W/B
  • EDF: 2L embedded-die substrate
  • Dimension: LGA 5.5x4.2mm²
  • Protection: Molding with clean CPD

 

Optical SiP Module

Applications

  • Heart Rate Monitoring & Heart Rate Variability, SpO2, Skin Temperature, Blood Pressure
  • Handset, Wearables & Fitness

Features

  • Integrated ARM-Cortex M4 MCU
  • Integrated 24bits AFE (Analog front-end) for optical sensing
  • Optical photo sensor with Red & IR & Green LED
  • Embedded motion cancellation algorithm &skin variation
  • Embedded die substrate: SESUB
  • Micro LENs molding, double molding
  • Lid open-cavity capping

 

Environment Sensor SiP Module

Applications

  • Handset, Wearables, IoT
  • Smart Home & Building
  • Automotive, Industry

Features

  • All-in-one SiP: Bluetooth v4.2 (BLE), ARM Cortex – M0 MCU
  • Temperature/Humidity/Pressure sensing
  • Package: open cavity WL SiP, TSV

 

Ambient Light/UV Sensor SiP Module

Applications

  • Environment
  • Smart Home & Building

Features

  • All-in-one SiP: Bluetooth v4.2 (BLE), ARM Cortex – M0 MCU
  • High resolution ADC for lighting channel (green/white/UV/IR)
  • Excellent UV sensibility
  • UV/ALS software for UV level & lighting control
  • Package: FOCSP, Micro LENs molding

 

Motion Sensor SiP Module

Applications

  • Wearables, Fitness
  • Smart Home & Building
  • Industry

Features

  • All-in-one SiP: Bluetooth v4.2 (BLE), ARM Cortex – M0 MCU
  • 3-axis acceleration sensor (range: 16G)
  • Embedded motion software for security detection

 

Gas Sensor SiP Module

Applications

  • IAQ Monitoring for Smartphones, Accessories and Connected Home Devices
  • Alcohol Breathalyzer in Consumer Devices
  • Smart City

Features

  • Air quality sensor
    CO2 (eCO2): from 400ppm TO 5000oom
    TVOC (the total volatile organic compound): from 0ppb to 1000ppb
    Dimension: 4x2.7x1.1mm
  • Temperature/Humidity/Pressure sensing
  • Package: Open cavity WL SiP, TSV

 

Gesture Sensor SiP Module

Applications

  • Handset, Wearables, IoT
  • Smart Home & Building, Hospital
  • Automotive

Features

  • All-in-one SiP: Bluetooth v4.2 (BLE), ARM Cortex – M0 MCU
  • R transmitter/receiver
  • Embedded gesture software for application control
  • Package: MEMS, TSV, Optical, IR sensing, cavity, selective molding

 

Magnetic/IR Sensor SiP Module

Applications

Magnetic sensor
  • Magnetic Temper Detection
IR sensor
  • Stationary Human Detection
  • Sunlight & Motion Detection

Features

Magnetic sensor
  • 16 bit data out for each magnetic component
  • Dimension: 3.0x3.0x0.75mm
  • Package: MEMS, TSV
IR sensor
  • Quantum-type with four IR elements
  • Dimension: 4.6x3.8x1.9mm

 

This website uses Cookies to optimize your experience. By choosing to continue, you agree to the use of Cookies and our Cookie Terms. To know more about Cookies and how to enable and disable cookies, please see “How to change Cookie preferences or disable Cookies?” in our Cookie Terms.

Accept Cookies