Press Room
ASE Drives AI and Green Transformation for a Sustainable Future in Kaohsiung
ASE Kaohsiung is advancing smart and green transformation, integrating advanced AI technologies to drive semiconductor growth while prioritizing sustainability. At the 2025 Smart City Summit & Expo, ASE showcased its AI-integrated smart building, AI-driven wastewater management, and waste recycling breakthroughs, fostering industry collaboration and global partnerships for sustainable urban development.
ASE has been integrating AI and automation across its manufacturing facilities to enhance efficiency and reduce resource consumption. Aligned with the 2025’s theme, “Digital & Green Transformation”, ASE introduced a fully AI-enabled smart building at its Kaohsiung campus, designed to enhance efficiency and create a truly intelligent factory. The introduction of advanced automation helps to enhance its operations, optimizing workflows and factory systems. Smart manufacturing boosts its efficiency and contributes to the overall development of sustainable and smart cities.
With the semiconductor industry prioritizing carbon reduction and net-zero goals, ASE is focused on optimizing its processes, including pollution control, water treatment and waste recycling to minimize environmental impact.
In addition, ASE participated in a forum addressing carbon taxes where its representative shared insights on sustainability strategies, intelligent carbon reduction, and the company’s initiatives on fostering a green supply chain.
ASE remains committed to driving long-term urban development and shaping a low-carbon, smart, and green future in the city of Kaohsiung.
About ASE, Inc.
Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative VIPack™, advanced packaging, and system-in-package solutions to meet growth momentum across a broad range of end markets, including AI, automotive, 5G, high-performance computing, and more. To learn about our advances in SiP, fanout, MEMS and sensor, flip chip, and 2.5D, 3D and TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: ASE Website , or follow us on LinkedIn & X: @aseglobal.
