Wire Bond BGA
Ball-grid arrays (BGA) are IC packages, which place output pins in the form of a solder ball matrix. The traces of the BGA are generally fabricated on laminated substrates (BT-based) or polyimide-based films. Therefore, the entire area of substrates or films can be used to route the interconnection. BGA has the advantage of lower ground or power inductance thereby assigning ground or power nets via a shorter current path to PCB. Thermally enhanced mechanisms (heat sink, thermal balls, etc.) can be applied to BGA in order to reduce thermal resistance. The higher functional capabilities of the BGA package technology benefit high-power and high-speed ICs that require enhanced electrical and thermal performance.
Compared with traditional SMT packages, the advantages of BGA are as follows:
- Higher interconnect density
- Lower assembly cost
- Self-alignment during reflow
- Lower profile
- Ease of thermal and electrical management
- Ease of routing
ASE Wire Bond BGA Packaging Offerings
Plastic ball grid array (PBGA) are BGA packages adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA has an overall thickness of over 1.7mm.
Applications
ASE PBGA's design and features improve the performance of
- Graphics
- PC Chipsets
- Microprocessors/Controllers
- PLDs
- Communications
- ASIC, Gate Arrays
- DSPs
- Networking
- Memory Packages
Features
BGA is suitable for high-power and high-speed ICs requiring superb electrical and thermal enhancement.
- 15x15mm to 45x45mm package
- Low assembly cost
- Ease of thermal and electrical management
- JEDEC MS-034 standard outlines
- 119 balls to 1520 ball count
- Self-alignment during reflow
- Ease of routing
- Lead-free process available
- High interconnect density
- Low profile
- Good power dissipation
- Full In-house design capability
