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The world is rapidly transitioning from an internet economy to an AI economy. In the internet economy, we stayed constantly connected to the internet 24/7 through our smartphones, PCs, and IoT devices. However, in the AI economy, every aspect of our lives are interwoven with artificial intelligence. You may already… Read More
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Cu-to-Cu direct bonding plays an important role in three-dimensional integrated circuits (3D IC). However, the bonding process always requires high temperature, high pressure, and a high degree of consistency in height. In this study, Sn is passivated over electroplated copper. Because Sn is a soft material and has a low… Read More
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There are still many unknowns as we continue through challenging global times. However, it is inspiring to see such game-changing innovation within the semiconductor industry, ultimately enabling applications that are literally changing lives, from health to transportation, from robotics to AI, from edge to cloud, from 5G to beyond. Collectively,… Read More
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Heterogeneous integration technology makes possible the integration of multiple separately manufactured components into a single higher level assembly with enhanced functionality and improved operating characteristics. Various types of advanced heterogeneous packages are available, including 2.5-D integrated circuit (IC), fan-out chip on substrate (FOCoS) chip-first, and FOCoS chip-last. This study constructs… Read More
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The demand for high bandwidth and high-performance applications such as networking, AI computing and GPU IC chips are driving innovative developments in advanced IC packaging. Heterogeneous integration enables the integration of multiple chips using fine line/space interconnect packaging technology. Heterogeneous integration packaging solutions offered in the market today include, through… Read More
