This is posts with tag name "5G"

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High Accuracy Selective Patterning for EMI Shielding of 5G AiP

System-in-Package (SiP) module with higher component density and smaller form size was demonstrated through selective structure. The selective EMI shielding at partial molding area for specific substrate circuit exposure through roller-type auto taping / detaping of PI tape was performed. This PI tape was applied on to designed area and… Read More