This is posts with tag name "Electroless Plating"


Development of High Copper Concentration, Low Operating Temperature, and Environmentally Friendly Electroless Copper Plating Using a Copper ‐ Glycerin Complex Solution

Few researchers have studied high metal ions concentration electroless platng solutions since increasing metal ions concentration shortens the solution life considerably. Nevertheless, as the required thickness of the electroless plating film reduces gradually, the limited solution life will not be a large problem. There are no detailed studies on the influence of… Read More