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Reliability Prediction and Improvement of Board-Level Thermal Cycling Test for Molded Flip-Chip Ball-Grid-Array Package
Borrowing the digital twin spirit, the virtual model (CAE simulated) and the physical model (real tests) were used to construct the lifecycle prediction curve for Molded Flip-Chip Ball-Grid-Array Package (MFCBGA) with SAC305 solder ball. The energy based Morrow’s model was used to fit the data points from both virtual and… Read More
