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As the demand for high-performance computing (HPC) continues to grow, chiplets and heterogeneous integration have emerged as key solutions due to their significant advantages in improving yield, reusing IP, enhancing performance, and optimizing costs. The integration of chiplets, particularly for AI applications, necessitates a greater number of connections than traditional… Read More
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In chiplet integration applications, various chips from different vendors can be integrated into one package structure using the Universal Chiplet Interconnect Express (UCIe) standard. Fan-Out Chip on Substrate (FOCoS) is a promising advanced package that can achieve high channel density and high bandwidth. However, crosstalk in high-speed signals is a… Read More
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As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional density and lower cost per function. With the continuous development of major semiconductor applications such as AI HPC, Edge AI and Autonomous Electrical… Read More
