This is posts with tag name "Packaging Design"

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Integrated Design Ecosystem™ for Chiplets and Heterogeneous Integration in Advanced Packaging Technology

As the demand for high-performance computing (HPC) continues to grow, chiplets and heterogeneous integration have emerged as key solutions due to their significant advantages in improving yield, reusing IP, enhancing performance, and optimizing costs. The integration of chiplets, particularly for AI applications, necessitates a greater number of connections than traditional… Read More

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Advanced Packaging Design for Heterogeneous Integration

As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional density and lower cost per function. With the continuous development of major semiconductor applications such as AI HPC, Edge AI and Autonomous Electrical… Read More