This is posts with tag name "Panel Level Fan-out"


Panel Level IC-Package Technology Development

The Fifth and Sixth Generation wireless strong demands driving IC-Package development into a newly formed in higher performance, more heterogeneous integration towards commercialization, Commercialization needs an advanced fabrication platform (e.g. Panel Level Platform, PL). The promising PL IC-Package technology on outsourced semiconductor assembly/testing provides the right solution. We have successfully… Read More