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In chiplet integration applications, various chips from different vendors can be integrated into one package structure using the Universal Chiplet Interconnect Express (UCIe) standard. Fan-Out Chip on Substrate (FOCoS) is a promising advanced package that can achieve high channel density and high bandwidth. However, crosstalk in high-speed signals is a… Read More
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As the increasingly demand of computer, communication and consumer electronics in recent years, flip-chip ball grid array (FCBGA) with ajinomoto build-up film (ABF) substrate is major package for performance request. But if we consider performance, substrate resource, and cost, alternative package structure is need to replace FCBGA. Hence, two alternative… Read More
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High-performance products including 5G mobile communication, network server and AI require big data transmission, data rate increase and broader bandwidth. In this paper, the novel bridge die package will be discussed in terms of electrical performance. Two RDL layers based on bridge die package will be analyzed by routing design… Read More
