2022 / 06 / 17

Electrical Performance Analysis for Bridge Die Package Solution

Po Chih Pan; Fu Cheng Chu; Hung Chun Kuo; Ming Fong Jhong; Chih Yi Huang; Chen Chao Wang

High-performance products including 5G mobile communication, network server and AI require big data transmission, data rate increase and broader bandwidth. In this paper, the novel bridge die package will be discussed in terms of electrical performance. Two RDL layers based on bridge die package will be analyzed by routing design patterns, and the analyses are including measurement and SI simulation. The S-Parameter measurement and simulation will be performed. Finally, the result shows a good correlation on bridge die package platform.

Published in: 2022 International Conference on Electronics Packaging (ICEP)

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