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Capabilities
Advanced Technologies
Overview
Heterogeneous Integration
VIPack™
Advanced RDL Packaging
2.5D and 3D IC Packaging
FOCoS
FOPoP
Silicon Photonics
System-in-Package
Overview
Double Side Molding
Fan-Out System-in-Package
3D System-in-Package
Antenna in Package
Embedded Die Substrate
MEMS and Sensors Packaging
Traditional IC Packaging
Overview
Leadframe Packaging
Wire Bond BGA
Flip Chip Packaging
Wafer Level Packaging
Fan-Out Packaging
Others
Test Services
Packaging Substrate
Substrate Design
Package Design
Lab Services
Applications
Smart Home
Smart Bike
Smart City
Smart Automotive
Smart Factory
Sustainability
Overview
Sustainability Governance
Environment and Green Innovation
Employee Care & Development
Supply Chain Development
Social Involvement
Press Center
Press Room
Events
Blog
About ASE
Company Info
Corporate Governance
Intellectual Property
Financials
Careers at ASE
Global Manufacturing
Contact Us
English 中文
Capabilities
Advanced Technologies
Overview
Heterogeneous Integration
VIPack™
Advanced RDL Packaging
2.5D and 3D IC Packaging
FOCoS
FOPoP
Silicon Photonics
System-in-Package
Overview
Double Side Molding
Fan-Out System-in-Package
3D System-in-Package
Antenna in Package
Embedded Die Substrate
MEMS and Sensors Packaging
Traditional IC Packaging
Overview
Leadframe Packaging
Wire Bond BGA
Flip Chip Packaging
Wafer Level Packaging
Fan-Out Packaging
Others
Test Services
Packaging Substrate
Substrate Design
Package Design
Lab Services
Applications
Smart Home
Smart Bike
Smart City
Smart Automotive
Smart Factory
Sustainability
Overview
Sustainability Governance
Environment and Green Innovation
Employee Care & Development
Supply Chain Development
Social Involvement
Press Center
Press Room
Events
Blog
About ASE
Company Info
Corporate Governance
Intellectual Property
Financials
Careers at ASE
Global Manufacturing
Contact Us
Transforming package solutions for next generation 3D Heterogeneous Integration Architectures
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Industry 4.0
What manufacturing looks like in the digital era
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Amplifying the Future of Smart Hearables with ASE SiP Solutions
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ASE's State-of-the-Art Labs
Fully equipped labs can help ASE’s customers to optimize product performance, yield, process and cost of manufacturing and operation.
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5G mmWave Smart Factory
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Semiconductor Turnkey Solutions

Semiconductor Turnkey Solutions

We are involved in all stages of the semiconductor manufacturing process. Services from front-end engineering test, wafer probing, package design, substrate design and manufacturing, packaging & test, module, board assembly & test and distribution are fully integrated onto a single supply chain.

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Smart Manufacturing

Smart Manufacturing

Automation, heterogeneous integration in machine and production systems, and heterogeneous integration in systems-in-package (SiP) are 3 major forces driving smart factories and digital transformation at ASE。

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Technology Leadership

Technology Leadership

ASE continues to lead the semiconductor industry with its cutting edge IC packaging technologies to meet the requirements of high-performance electronics products.

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Sustainable Development

Sustainable Development

ASE believe that the sustainable development of our enterprise and the realization of its social responsibilities are vital to our long-term strategies and success.

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EVENTS & PRESS ROOM

Events

Dec 07, 2022 – Dec 09, 2022

Electronics Packaging Technology Conference (EPTC 2022)

Dec 08, 2022 – Dec 08, 2022

GSA Awards Celebration 2022

Dec 26, 2022 – Dec 27, 2022

ICCAD 2022

News

Nov 10, 2022

ASE Breaks Ground on New Chip Assembly and Testing Facility in Penang, Malaysia

Nov 03, 2022

ASE announces FOCoS advancements under the VIPack™ Platform

Oct 04, 2022

ASE announces Dr. William Chen is the 2022 recipient of IMAPS Daniel C. Hughes, Jr. Memorial Award

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