loading
Capabilities
Advanced Technologies
Overview
Heterogeneous Integration
System-in-Package
2.5D & 3D
Fan-Out Packaging
Embedded Die Substrate
MEMS & Sensors Packaging
Antenna in Package
FOCoS
IC Packaging
Overview
Flip Chip Packaging
Wire Bond BGA
Leadframe Packaging
Wafer Level Packaging
Others
Packaging Substrate
Substrate Design
Package Design
Bumping Services
Test Services
Applications
Smart Home
Smart Bike
Smart City
Smart Automotive
Smart Factory
Sustainability
Sustainability
Overview
Sustainability Policy
Compliance and Risk Management
Business Conduct and Ethics
Environment
Overview
Management System
Energy Management
Water Recycling
Green Facility
Sustainable Manufacturing
Employee
Overview
Human Rights Management
Employee Care
Employee Development
Employee Health and Safety
Supply Chain
Overview
Supply Chain Management
Supplier Sustainability
Conflict Minerals Compliance
Social Involvement
Overview
Environmental Conservation
Industry-Academic
Community Engagement
Public Advocacy
Press Center
Press Room
Events
Blog
About ASE
Company Info
Overview
Services at a Glance
Milestones
Awards
Corporate Governance
Financials
Careers at ASE
IP & Trademarks
Intellectual Property
ASE Trademarks
Contact Us
Global Manufacturing
Sales/Media/CSR Contacts
Website Feedback
English 中文
Capabilities
Advanced Technologies
Overview
Heterogeneous Integration
System-in-Package
2.5D & 3D
Fan-Out Packaging
Embedded Die Substrate
MEMS & Sensors Packaging
Antenna in Package
FOCoS
IC Packaging
Overview
Flip Chip Packaging
Wire Bond BGA
Leadframe Packaging
Wafer Level Packaging
Others
Packaging Substrate
Substrate Design
Package Design
Bumping Services
Test Services
Applications
Smart Home
Smart Bike
Smart City
Smart Automotive
Smart Factory
Sustainability
Sustainability
Overview
Sustainability Policy
Compliance and Risk Management
Business Conduct and Ethics
Environment
Overview
Management System
Energy Management
Water Recycling
Green Facility
Sustainable Manufacturing
Employee
Overview
Human Rights Management
Employee Care
Employee Development
Employee Health and Safety
Supply Chain
Overview
Supply Chain Management
Supplier Sustainability
Conflict Minerals Compliance
Social Involvement
Overview
Environmental Conservation
Industry-Academic
Community Engagement
Public Advocacy
Press Center
Press Room
Events
Blog
About ASE
Company Info
Overview
Services at a Glance
Milestones
Awards
Corporate Governance
Financials
Careers at ASE
IP & Trademarks
Intellectual Property
ASE Trademarks
Contact Us
Global Manufacturing
Sales/Media/CSR Contacts
Website Feedback
Industry 4.0
What manufacturing looks like in the digital era
MORE
Semiconductors are changing our world.
ASE is out front, innovating across packaging technology and ecosystem to facilitate the timely manufacture of semiconductor devices enabling higher performance, lower power, greater speed, and increased bandwidth.
MORE
System-in-Package
The drive towards miniaturization and integration is rapidly unleashing the power and potential of System-in-Package (SiP). ASE is the leader in SiP technologies from design to assembly and high volume manufacturing.
MORE
Fan Out Packaging
Fan Out packaging continues to gain major prominence within the industry. ASE is evolving this packaging platform to meet application demands for smaller, thinner, and faster electronic systems.
MORE
MEMS & Sensors Packaging
ASE’s packaging portfolio for MEMS and Sensors include process flexibility, materials expertise, co-design capabilities, turnkey assembly & test services, and customized SiP.
MORE
Semiconductor Turnkey Solutions

Semiconductor Turnkey Solutions

We are involved in all stages of the semiconductor manufacturing process. Services from front-end engineering test, wafer probing, package design, substrate design and manufacturing, packaging & test, module, board assembly & test and distribution are fully integrated onto a single supply chain.

Watch More
Technology Leadership

Technology Leadership

ASE continues to lead the semiconductor industry with its cutting edge IC packaging technologies to meet the requirements of high-performance electronics products.

Watch More

EVENTS & PRESS ROOM

Events

Dec 01, 2021 – Dec 03, 2021

Electronics Packaging Technology Conference (EPTC 2021)

Dec 01, 2021 – Dec 03, 2021

EPTC Singapore 2021

Dec 07, 2021 – Dec 09, 2021

SEMICON West 2021

News

Nov 22, 2021

ASE Technology Holding Tops List of Semiconductors and Semiconductor Equipment Companies on the 2021 Dow Jones Sustainability Indices

Nov 18, 2021

ASE receives Distinguished Award from Taiwan’s Ministry of Labor - Occupational Safety and Health Administration

Nov 12, 2021

ASE Kaohsiung receives ISO 46001 Certification for Water Efficiency Management

This website uses Cookies to optimize your experience. By choosing to continue, you agree to the use of Cookies and our Cookie Terms. To know more about Cookies and how to enable and disable cookies, please see “How to change Cookie preferences or disable Cookies?” in our Cookie Terms.

Accept Cookies