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Capabilities
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IC Packaging
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English 中文
Capabilities
Advanced Technologies
Overview
System-in-Package
Heterogeneous Integration
2.5D & 3D
Fan-Out Packaging
Embedded Die Substrate
MEMS & Sensors Packaging
Antenna in Package
FOCoS
IC Packaging
Overview
Flip Chip Packaging
Wire Bond BGA
Leadframe Packaging
Wafer Level Packaging
Others
Packaging Substrate
Substrate Design
Package Design
Bumping Services
Tray Supply
Test Services
Applications
Smart Living
Smart Bike
Smart City
Smart Automotive
Smart Factory
Investor Relations
Shareholder Services
Annual Reports
Dividends History
Shareholders' Meeting
FAQ
Financials
Monthly Revenues
Quarterly Results
Financial Reports
Stock Exchange Filings
XBRL Files
Corporate Governance
Overview
Board of Directors
Corporate Governance Comparison
Conflict Minerals Policy
Events & News
IR Events
IR News
Sustainability
Sustainability
Overview
Sustainability Policy
Compliance and Risk Management
Business Conduct and Ethics
Environment
Overview
Management System
Energy Management
Water Recycling
Green Facility
Sustainable Manufacturing
Green Bond
Employee
Overview
Human Rights Management
Employee Care
Employee Development
Employee Health and Safety
Supply Chain
Overview
Supplier Sustainability
Supplier Awards
Conflict Minerals Policy
Social Involvement
Overview
Environmental
Industry-Academic
Community Engagement
Public Advocacy
About ASE
Company Info
Overview
Milestones
Awards
Turnkey Services
Careers at ASE
Downloads
Press Center
Press Room
Events
Blog
Supplier Management
Overview
Supply Chain Strategy
Supply Chain Development
Become ASE's Supplier
IP & Trademarks
Intellectual Property
ASE Trademarks
Contact Us
Global Manufacturing
Sales and Media Enquiries
Website Feedback
5G mmWave Smart Factory
Embracing the Future Today with 5G
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Semiconductors are changing our world.
ASE is out front, innovating across packaging technology and ecosystem to facilitate the timely manufacture of semiconductor devices enabling higher performance, lower power, greater speed, and increased bandwidth.
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System-in-Package
The drive towards miniaturization and integration is rapidly unleashing the power and potential of System-in-Package (SiP). ASE is the leader in SiP technologies from design to assembly and high volume manufacturing.
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Fan Out Packaging
Fan Out packaging continues to gain major prominence within the industry. ASE is evolving this packaging platform to meet application demands for smaller, thinner, and faster electronic systems.
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MEMS & Sensors Packaging
ASE’s packaging portfolio for MEMS and Sensors include process flexibility, materials expertise, co-design capabilities, turnkey assembly & test services, and customized SiP.
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Semiconductor Turnkey Solutions

Semiconductor Turnkey Solutions

We are involved in all stages of the semiconductor manufacturing process. Services from front-end engineering test, wafer probing, package design, substrate design and manufacturing, packaging & test, module, board assembly & test and distribution are fully integrated onto a single supply chain.

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Technology Leadership

Technology Leadership

ASE continues to lead the semiconductor industry with its cutting edge IC packaging technologies to meet the requirements of high-performance electronics products.

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EVENTS & PRESS ROOM

Events

May 31, 2021 – Jun 30, 2021

Computex Taipei

Jun 01, 2021 – Jul 04, 2021

Electronic Components and Technology Conference (ECTC) 2021

Jul 13, 2021 – Jul 14, 2021

SEMI America’s “Innovation For A Transforming World”

News

May 10, 2021

ASE Kaohsiung achieves 20 million tons of Water Savings Milestone in line with its Water Management Strategy

Apr 15, 2021

ASE Singapore Named One of the Most Attractive Employers

Apr 06, 2021

ASE wins Sustainability Award

CSR News

Nov 16, 2020

ASE Technology Holding Named 2020 Industry Leader in the Dow Jones Sustainability Indices

Sep 16, 2019

ASE Named 2019 Industry Leader in the Dow Jones Sustainability Indices

Mar 25, 2019

ASE Technology Holding takes a spot on CDP Climate A List 2018

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