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Transforming package solutions for next generation 3D Heterogeneous Integration Architectures
Industry 4.0
What manufacturing looks like in the digital era
Amplifying the Future of Smart Hearables with ASE SiP Solutions
ASE's State-of-the-Art Labs
Fully equipped labs can help ASE’s customers to optimize product performance, yield, process and cost of manufacturing and operation.
5G mmWave Smart Factory
Semiconductor Turnkey Solutions

Semiconductor Turnkey Solutions

We are involved in all stages of the semiconductor manufacturing process. Services from front-end engineering test, wafer probing, package design, substrate design and manufacturing, packaging & test, module, board assembly & test and distribution are fully integrated onto a single supply chain.

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Smart Manufacturing

Smart Manufacturing

Automation, heterogeneous integration in machine and production systems, and heterogeneous integration in systems-in-package (SiP) are 3 major forces driving smart factories and digital transformation at ASE。

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Technology Leadership

Technology Leadership

ASE continues to lead the semiconductor industry with its cutting edge IC packaging technologies to meet the requirements of high-performance electronics products.

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Sustainable Development

Sustainable Development

ASE believe that the sustainable development of our enterprise and the realization of its social responsibilities are vital to our long-term strategies and success.

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