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Capabilities
Advanced Technologies
Overview
Heterogeneous Integration
2.5D & 3D IC Packaging
FOCoS
Silicon Photonics
System-in-Package
Double Side Moldings (DSM)
Fan-Out System in Package
3D System-in-Package
Antenna in Package
Embedded Die Substrate
MEMS & Sensors Packaging
IC Packaging
Overview
Leadframe Packaging
Wire Bond BGA
Flip Chip Packaging
Wafer Level Packaging
Fan-Out Packaging
Others
Test Services
Packaging Substrate
Substrate Design
Package Design
Lab Services
Applications
Smart Home
Smart Bike
Smart City
Smart Automotive
Smart Factory
Sustainability
Overview
Sustainability Governance
Environment and Green Innovation
Employee Care & Development
Supply Chain Development
Social Involvement
Press Center
Press Room
Events
Blog
About ASE
Company Info
Corporate Governance
Intellectual Property
Financials
Careers at ASE
Global Manufacturing
Contact Us
English 中文
Capabilities
Advanced Technologies
Overview
Heterogeneous Integration
2.5D & 3D IC Packaging
FOCoS
Silicon Photonics
System-in-Package
Double Side Moldings (DSM)
Fan-Out System in Package
3D System-in-Package
Antenna in Package
Embedded Die Substrate
MEMS & Sensors Packaging
IC Packaging
Overview
Leadframe Packaging
Wire Bond BGA
Flip Chip Packaging
Wafer Level Packaging
Fan-Out Packaging
Others
Test Services
Packaging Substrate
Substrate Design
Package Design
Lab Services
Applications
Smart Home
Smart Bike
Smart City
Smart Automotive
Smart Factory
Sustainability
Overview
Sustainability Governance
Environment and Green Innovation
Employee Care & Development
Supply Chain Development
Social Involvement
Press Center
Press Room
Events
Blog
About ASE
Company Info
Corporate Governance
Intellectual Property
Financials
Careers at ASE
Global Manufacturing
Contact Us
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Industry 4.0
What manufacturing looks like in the digital era
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System-in-Package
The drive towards miniaturization and integration is rapidly unleashing the power and potential of System-in-Package (SiP). ASE is the leader in SiP technologies from design to assembly and high volume manufacturing.
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Fan Out Packaging
Fan Out packaging continues to gain major prominence within the industry. ASE is evolving this packaging platform to meet application demands for smaller, thinner, and faster electronic systems.
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MEMS & Sensors Packaging
ASE’s packaging portfolio for MEMS and Sensors include process flexibility, materials expertise, co-design capabilities, turnkey assembly & test services, and customized SiP.
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Semiconductor Turnkey Solutions

Semiconductor Turnkey Solutions

We are involved in all stages of the semiconductor manufacturing process. Services from front-end engineering test, wafer probing, package design, substrate design and manufacturing, packaging & test, module, board assembly & test and distribution are fully integrated onto a single supply chain.

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Smart Manufacturing

Smart Manufacturing

Automation, heterogeneous integration in machine and production systems, and heterogeneous integration in systems-in-package (SiP) are 3 major forces driving smart factories and digital transformation at ASE。

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Technology Leadership

Technology Leadership

ASE continues to lead the semiconductor industry with its cutting edge IC packaging technologies to meet the requirements of high-performance electronics products.

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Sustainable Development

Sustainable Development

ASE believe that the sustainable development of our enterprise and the realization of its social responsibilities are vital to our long-term strategies and success.

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EVENTS & PRESS ROOM

Events

May 25, 2022 – May 27, 2022

World Semiconductor Conference (WSCE)

May 30, 2022 – May 30, 2022

SEMI Industry Strategy Symposium Europe 2022

May 31, 2022 – Jun 03, 2022

Electronic Components and Technology Conference (ECTC) 2022

News

Apr 21, 2022

ASE Singapore named on the Straits Times Best Employers 2022 for the Third Consecutive Year

Apr 08, 2022

ASE Kaohsiung Receives Smart Energy Certification

Mar 02, 2022

Leaders in Semiconductors, Packaging, IP Suppliers, Foundries, and Cloud Service Providers Join Forces to Standardize Chiplet Ecosystem

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