
Technology Leadership
ASE is a primary architect of Heterogeneous Integration (HI)
Our technologies have enabled our customers to create cutting edge products that deliver superior performance, power, speed, and connectivity.
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Markets Enabled by ASE and Semiconductors
Applications fueled by Semiconductor Innovation

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News
ASE Drives AI and Green Transformation for a Sustainable Future in Kaohsiung
2025.03.20

News
Ainos and ASE Partner to Power AI Scent Digitization in Semiconductor Manufacturing
2025.03.12

Technology
Innovation and Collaboration in Power Module Packaging: A Thermal Perspective
2025.03.03

News
ASE Expands its Chip Packaging and Testing Facility to Enable Next-Gen Applications
2025.02.18

Technology
Integrated Design Ecosystem™ for Chiplets and Heterogeneous Integration in Advanced Packaging Technology
2025.01.21

Technology
AI and Semiconductor in Reciprocity
2025.01.21

Technology
Advanced Packaging Evolution: Chiplet and Silicon Photonics-CPO
2025.01.06

Technology
Accelerating the AI Economy through Heterogeneous Integration
2024.11.21

News
ISE Labs Investment Secures the Establishment of New Site for Semiconductor Packaging and Test in Mexico
2024.11.07

News
ASE Partners with Environmental Technology Research to Drive Net-Zero Transformation and Expand Green Energy Initiatives
2024.11.07

News
ASE “Guardians of the Sea” Wins Gold at the PwC Sustainability Impact Awards
2024.10.25

News
ASE K28 Groundbreaking Ceremony: Strengthening Our Commitment to Innovation and Technological Leadership
2024.10.09

News
ISE Labs Expands Capabilities, Doubles Lab Space with Opening of Second Silicon Valley Location
2024.07.11

News
ASE introduces powerSiP™ for transformative power delivery that increases power efficiencies by 50% in AI and data center applications
2024.05.29

Technology
AI-Driven Innovation for Manufacturing Automation
2023.12.01