ASE is out front, innovating across packaging technology and ecosystem to facilitate the timely manufacture of semiconductor devices enabling higher performance, lower power, greater speed, and increased bandwidth.
The drive towards miniaturization and integration is rapidly unleashing the power and potential of System-in-Package (SiP). ASE is the leader in SiP technologies from design to assembly and high volume manufacturing.
We are involved in all stages of the semiconductor manufacturing process. Services from front-end engineering test, wafer probing, package design, substrate design and manufacturing, packaging & test, module, board assembly & test and distribution are fully integrated onto a single supply chain.