Explore ASE’s Sustainability strategy, stakeholder engagement, activities and performance, and download CSR reports.
We are involved in all stages of the semiconductor manufacturing process. Services from front-end engineering test, wafer probing, package design, substrate design and manufacturing, packaging & test, module, board assembly & test and distribution are fully integrated onto a single supply chain.
Watch MoreASE continues to lead the semiconductor industry with its cutting edge IC packaging technologies to meet the requirements of high-performance electronics products.
Watch MoreASE believe that the sustainable development of our enterprise and the realization of its social responsibilities are vital to our long-term strategies and success.
Watch MoreMar 14, 2023
ASE drives latency and bandwidth innovation with VIPack™ Fanout Package-on-Package
Jan 14, 2023
ASE’s Bumping Factory in Kaohsiung, Taiwan inducted into the World Economic Forum’s Global Lighthouse Network
Nov 10, 2022
ASE Breaks Ground on New Chip Assembly and Testing Facility in Penang, Malaysia