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Technology
System-in-Package
SiP Intelligent Design
Heterogeneous Integration
Wireless SiP
Computing Storage SiP
Power SiP
Sensor Optical SiP
2.5D & 3D
TSV Interposer
Fan Out Packaging
Embedded Die Technology
FOCOS
MEMS & Sensors Packaging
Wafer Level Mems
Assembly
Flip Chip
Flip Chip CSP
Flip Chip BGA
FCBGA
FCCSP
HP Flip Chip BGA
Cu Pilliar
Solder Bumping
Wire Bond BGA
PBGA
HSBGA
FBGA
Leadframe
QFN
aQFN
QFP
LQFP/TQFP
PLCC
SO
PDIP
Wafer Level
aCSP/WLCSP
aWLP
WL IPD
WL MEMS
Substrate & Services
Packaging Substrate
Substrate Design
PBGA Substrate
BOC Substrate
Memory Card Substrate
Module Substrate
a-S3 Substrate
Advanced Substrate
Lab Service
Electrical
Material
Stress and Thermal
Chemical and Green
Failure Analysis
Optical
E-service
Bumping Service
Test Service
Test Service Offerings
Semiconductor Test
Tray Service
Tray Service Offerings
Investor Relations
Shareholder Services
Annual Reports
Dividends History
Shareholders' Meeting
Financials
Monthly Revenues
Quarterly Results
Financial Reports
Stock Exchange Filings
XBRL Files
Corporate Governance
Board of Directors
Corporate Governance Comparison
Conflict Minerals Compliance
Events & News
IR Events
IR News
FAQ
Sustainability
Governance
Corporate Sustainability Policy
Regulatory Compliance and Risk Management
Business Conduct and Ethics
Environment
Management System and Certification
The Building of Smart Grid
Water Reclamation
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Sustainable Manufacturing
Green Bond
Employee
Human Rights Management
Employee Care
Employee Development
Employee Health and Safety
Supply Chain
Supplier Sustainability Management
Supplier Awards
Conflict Minerals Compliance
Social Involvement
Environmental Conservation
Industry-Academic Collaboration
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About ASE
Company Info
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Turnkey Services
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English 中文
Technology
System-in-Package
SiP Intelligent Design
Heterogeneous Integration
Wireless SiP
Computing Storage SiP
Power SiP
Sensor Optical SiP
2.5D & 3D
TSV Interposer
Fan Out Packaging
Embedded Die Technology
FOCOS
MEMS & Sensors Packaging
Wafer Level Mems
Assembly
Flip Chip
Flip Chip CSP
Flip Chip BGA
FCBGA
FCCSP
HP Flip Chip BGA
Cu Pilliar
Solder Bumping
Wire Bond BGA
PBGA
HSBGA
FBGA
Leadframe
QFN
aQFN
QFP
LQFP/TQFP
PLCC
SO
PDIP
Wafer Level
aCSP/WLCSP
aWLP
WL IPD
WL MEMS
Substrate & Services
Packaging Substrate
Substrate Design
PBGA Substrate
BOC Substrate
Memory Card Substrate
Module Substrate
a-S3 Substrate
Advanced Substrate
Lab Service
Electrical
Material
Stress and Thermal
Chemical and Green
Failure Analysis
Optical
E-service
Bumping Service
Test Service
Test Service Offerings
Semiconductor Test
Tray Service
Tray Service Offerings
Investor Relations
Shareholder Services
Annual Reports
Dividends History
Shareholders' Meeting
Financials
Monthly Revenues
Quarterly Results
Financial Reports
Stock Exchange Filings
XBRL Files
Corporate Governance
Board of Directors
Corporate Governance Comparison
Conflict Minerals Compliance
Events & News
IR Events
IR News
FAQ
Sustainability
Governance
Corporate Sustainability Policy
Regulatory Compliance and Risk Management
Business Conduct and Ethics
Environment
Management System and Certification
The Building of Smart Grid
Water Reclamation
Green Facility
Sustainable Manufacturing
Green Bond
Employee
Human Rights Management
Employee Care
Employee Development
Employee Health and Safety
Supply Chain
Supplier Sustainability Management
Supplier Awards
Conflict Minerals Compliance
Social Involvement
Environmental Conservation
Industry-Academic Collaboration
Community Engagement
Public Advocacy
About ASE
Company Info
Milestones
Awards
Turnkey Services
Careers at ASE
Downloads
Press Center
Press Room
Events
Supply Chain
Management
Development
Supplier Self-recommendation
IP & Trademarks
Intellectual Property
ASE Trademarks
Contact Us
Manufacturing Facilities Overview
Plants & Offices Contacts
Sales, Media, CSR Contacts
Smart Factory
Deploying Smart Manufacturing through Heterogeneous Integration and leadership in System-in-Package.
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Semiconductors are changing our world.
ASE is out front, innovating across packaging technology and ecosystem to facilitate the timely manufacture of semiconductor devices enabling higher performance, lower power, greater speed, and increased bandwidth.
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System-in-Package
The drive towards miniaturization and integration is rapidly unleashing the power and potential of System-in-Package (SiP). ASE is the leader in SiP technologies from design to assembly and high volume manufacturing.
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Fan Out Packaging
Fan Out packaging continues to gain major prominence within the industry. ASE is evolving this packaging platform to meet application demands for smaller, thinner, and faster electronic systems.
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MEMS & Sensors Packaging
ASE’s packaging portfolio for MEMS and Sensors include process flexibility, materials expertise, co-design capabilities, turnkey assembly & test services, and customized SiP.
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Semiconductor Turnkey Solutions

Semiconductor Turnkey Solutions

We are involved in all stages of the semiconductor manufacturing process. Services from front-end engineering test, wafer probing, package design, substrate design and manufacturing, packaging & test, module, board assembly & test and distribution are fully integrated onto a single supply chain.

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Technology Leadership

Technology Leadership

ASE continues to lead the semiconductor industry with its cutting edge IC packaging technologies to meet the requirements of high-performance electronics products.

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EVENTS & PRESS ROOM

Events

Jul 20, 2020 – Jul 24, 2020

SEMICON West 2020

News

Apr 22, 2020

ASE Singapore ranked amongst the Top 150 Best Employers in Singapore

Apr 13, 2020

ASE honors Outstanding Recipients of its 2019 Supplier Awards

Mar 19, 2020

ASE’s update on COVID-19

CSR News

Sep 16, 2019

ASE Named 2019 Industry Leader in the Dow Jones Sustainability Indices

Mar 25, 2019

ASE Technology Holding takes a spot on CDP Climate A List 2018

Aug 01, 2018

ASE listed on the FTSE4Good Index Series for the fourth consecutive year

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