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Stress and Thermal Lab

Modeling and Simulation

Stress-Thermal Laboratory provides package mechanical stress, thermal dissipation efficiency and mold flow phenomena analysis by numerical simulation report to customers for characterization evaluation. The analyses include package level such as die crack, delamination, and optimal design for low stress and high reliability; board-level stress analyses to predict the fatigue life of solder joints, like temperature-cycling-test (TCT), drop test, bending test, and other reliability tests. Besides, dissipating the heat effectively from the chip is a major challenge for engineers. ASE also provides services to conduct component-level and system-level thermal analyses. The modeling and simulation service include:

  • Thermal stress analysis (warpage, die stress, delamination)
  • System/board level analysis (TCT, drop, bending)
  • Physical coupling analysis (electro-thermal, thermo-mechanical)
  • Wirebonding/wire looping simulation
  • Customized heat sink effects
  • Preliminary thermal studies for MCM/SiP
  • Hot spots impact evaluations
  • Transient analyses for power pulse impacts
  • Compact thermal models (CTMs) for system-level simulations
  • Simulations for packages in sockets (burn-in/HTOL test conditions)
  • Mold flow prediction

Go to ASE eService to request electrical modeling and simulation service.

Measurement

Stress-Thermal Laboratory provides mechanical and thermal measurement services to verify the package and system stress and thermal dissipation performance after the package designed and manufactured. In additional to package level measurements, we also support customers on chip level or board level measurements. The measurement services include:

  • Die strength flexural measurement
  • Die pull measurement (evaluate UBM/bump structural integrity)
  • High speed ball impact measurement
  • Wafer/panel level warpage measurement
  • JEDEC/customized board level reliability measurement (TCT, drop, shock, bending)

Besides, thermal measurements include the measurements for package thermal parameters and material thermal conductivities:

  • θJA (junction-to-ambient thermal resistance)
  • θJC (junction-to-case thermal resistance)
  • θJB (junction-to-board thermal resistance)
  • ΨJT (junction-to-top thermal characterization parameter)
  • ΨJB (junction-to-board thermal characterization parameter)
  • Material thermal conductivity measurements

Package/System Design and Analysis

Base on long term experience and large database of package board level reliability, simulation, measurement and co-design projects with customers, ASE Stress-Thermal Laboratory developed package and system design capabilities to provide customers the pre-design solution. Package/System design and analysis service includes:

  • Warpage & component stress prediction
  • Packaging material selection & structure design
  • Package/board level reliability analysis
  • Thermal optimal design for packages
  • Customized co-design/simulation (system analysis and co-design)