Press Room

NEWS
2002 / 05 / 24

Announcement on the migration of email domain addresses to @aseglobal.com

Announcement on the Migration of email domain addresses to @aseglobal.com.

We are pleased to announce a corporate-wide program to migrate all ASE employees’ email addresses to @aseglobal.com. We wish to assure you that the migration program will not in any way affect our continuous quality service to our customers.
Upon completion of the migration exercise, ASE Group members will have an email domain address consistent with our corporate website www.aseglobal.com. The new addresses will also maximize the communication flow between our customers, partners and ASE, while eliminating the confusion of different domain names.
The exercise will occur in phases at each of our facilities and the schedule is outlined as follows:

Facility & locationScheduled Date of CompletionEmail address before migration (example)Email address after migration *(example)
ASE Test, Kaohsiung, TaiwanCompleted since Jan 2002test@email.asetest.com.twtest@aseglobcal.com
ASE Material, KaohsiungCompleted since Jan 2002material@aseml.asetwn.com.twmaterial@aseglobcal.com
ASE US and Europeby 30 Jun 2002usa@aseus.comusa@aseglobal.com
 by 15 Aug 2002europe@aseeu.comeurope@aseglobal.com
ASE Assembly, Kaohsiungby 15 Jul 2002assembly@asek.asetwn.com.twassembly@aseglobal.com
ASE Cavite, Philippinesby 15 Jul 2002philippines@asephil.comphilippines@aseglobal.com
ASE Chung Li, Taiwanby 30 Jul 2002chungli@asecl.com.twchungli@aseglobal.com
ASE Penang, Malaysiaby 1 Aug 2002malaysia@notes.aseml.com.mymalaysia@aseglobal.com
ASE Paju, Koreaby 15 Aug 2002korea@asekr.comkorea@aseglobal.com

* Your ASE contact will advise you of his/her new email address once the migration at his/her location takes effect. To ensure a smooth transition, the existing domain names of each location will remain operating for at least 6 months after migration.


 

About ASE, Inc.

ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com or follow us on on LinkedIn and X: @aseglobal.