ASE and Mitsui Sign Cross-licensing Agreement
Santa Clara, California, September 6th, 2007 – Advanced Semiconductor Engineering Incorporated (ASE, TAIEX: 2311, NYSE: ASX) and Mitsui High-tec, Inc. (MHT, TSE: 6966) announced today that they have entered into an agreement for cross licensing and technical collaboration for Mitsui High-tec’s HMTTM (Hybrid Manufacturing Technologies) packaging technology. Under this minimum five-year agreement, both parties will share intellectual property rights and technical expertise for the design and manufacture of HMT semiconductor packaging.
HMT is a leadframe based, area array package with a more flexible footprint than a multi-row QFN and conforms to both JEDEC and JEITA design standards. As HMT utilizes a copper leadframe, it boasts thermal, electrical, reliability and cost advantages over similar laminate based packages. In addition, HMT brings to the market a QFN type package that can penetrate much higher I/O applications, at a competitive cost.
“We are pleased to collaborate with industry pioneer Mitsui in this cross-licensing venture, ” said Dr. Ho-Ming Tong, Chief R&D Officer, ASE Group. “This agreement will truly benefit our customers, who require leading-edge QFN packaging technologies to ensure their competitiveness in the dynamic semiconductor market. The collaboration will enable ASE and Mitsui to meet stringent market demands and bring added value to our customers worldwide. ”
“Our HMT technology has been well-received within the industry therefore it makes sense to work together with industry leader ASE to strengthen the technology, increase market adoption, and accelerate the development of the companies’ current and future product lines, ” said Yasunari Mitsui, Mitsui High-tec’s Corporate Vice President. “Offering high reliability, HMT is projected to become mainstream technology in the semiconductor field in the near future, and we will partner closely with ASE to make this happen”
With rich portfolios of intellectual property and know-how on HMT technology at ASE and Mitsui High-tech, this agreement provides both companies a strong and mutually beneficial position for this product family while serving customers in this highly dynamic market. Both ASE and Mitsui High-tec have allocated expert engineering resources to expand and enhance HMT’s functionality and leverage its unique advantages to bring even more added value to the IC semiconductor market.
Financial terms for the cross-license agreement were not disclosed.”
About Mitsui High-tec
Mitsui High-tec is the world’s largest manufacturer of IC leadframes, with 19 manufacturing bases throughout the world. Mitsui High-tec manufactures precision tool and dies, and provides high quality IC leadframes to global customers based on ultra-precision manufacturing technologies developed since its inception. The company also offers IC assembly & test services, utilizing its in-house leadframes, tooling, jig, equipment and manufacturing technology. Mitsui High-tec satisfies customers’ various needs from development through production, with flexible, short turnaround and low cost solutions. Mitsui High-tec generated consolidated sales revenues of JPY57.4 billion in fiscal 2006 and employs over 3, 000 people worldwide. For more information about Mitsui High-tec, visit www.mitsui-high-tec.com.
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About ASE, Inc.
ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com or follow us on on LinkedIn and X: @aseglobal.