Press Room

2015 / 09 / 04

ASE announces signing ceremony with TDK on the inauguration of ASE Embedded Electronics Incorporated

Establishing System-in-Package dominance through industry collaboration with market leaders in cutting-edge semiconductor manufacturing technologies

Kaohsiung, September 4, 2015 – Advanced Semiconductor Engineering, Inc (TSE: 2311, NYSE: ASX) today announced the official inauguration of ASE Embedded Electronics Incorporated, at a formal signing ceremony in Kaohsiung with TDK Corporation and local officials.

On May 8th, 2015, both ASE and TDK entered into an agreement to establish a joint venture company, named ASE Embedded Electronics Incorporated, to manufacture IC embedded substrates using TDK’s SESUB®(Semiconductor Embedded in SUBstrate) technology. The ASE Embedded Electronics manufacturing facility is to be located in the Nantze Export Processing Zone, Kaohsiung City, Taiwan. ASE’s System-in-Package (SiP) solutions using SESUB technology will offer a robust embedded solution in enabling a wide number of applications such as PMIC, sensors, RF tuners, and many more. Through the joint venture company, ASE aims to leverage ASE’s capabilities in advanced packaging, test and module level solutions with TDK’s proven proprietary embedded technology to address escalating market needs for semiconductor miniaturization.

As a leader in SiP technology, ASE continues to expand its product and service portfolio through collaboration with key suppliers and partners. “Such alliances enable ASE to strengthen its SiP ecosystem and offer our customers a complete suite of solutions for integrating dozens of chips into smaller and thinner spaces in the advent of portable and wearable devices and the Internet of Things, ” said Dr. Tien Wu, COO, ASE Group.


About ASE, Inc.

ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: or follow us on on LinkedIn and X: @aseglobal.